New Equipment | Solder Materials
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t
Electronics Forum | Fri Apr 20 07:54:25 EDT 2007 | Bob R.
I'm in the high reliability (exempt) sector and have thermal cycled hundreds of boards in the past few years. As far as which is more reliable, SnPb or SAC305, my data is similar to what the technical literature is saying, "It Depends". In low stra
Electronics Forum | Thu Sep 23 08:47:25 EDT 2021 | majdi4
1)Though in many cases the difference between SAC305 and SAC405 was small,and not always statistically significant, it was observed that SAC405 generally outperformed SAC305 joints. Under 0°C to 100°C thermal cycling,no statistically significant
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
| https://pcbasupplies.com/alloy-solder-paste-enig/
: Koki Description Additional information Description High Reliability Alloy Solder Paste For ENIG High Reliability Alloy Solder Paste SAC305 Type-4 No-Clean High Reliability Lead-Free SAC305 Solder
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
. Poor solder joint fillet -- ramp up too slow The flux lost its activity once it stayed soaking too long. Reflow zone (above 217°C ~220°C for SAC305 solder paste
