Industry News | 2018-03-05 15:51:42.0
In recognition of his significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, long-time IPC volunteer, Robert Cooke, NASA Johnson Space Center, was presented with an IPC President’s Award at IPC APEX EXPO 2018.
Industry News | 2024-10-06 19:52:39.0
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
Technical Library | 2017-02-16 16:53:49.0
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.
SMTnet Express, February 16, 2017, Subscribers: 30,171, Companies: 15,128, Users: 41,915 Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders Thomas Sanders, Sivasubramanian
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smta-china-east-conference-2015
circuit board assembly after plasma treatment are shared and discussed. Authors: 赵建钢（Jack Zhao）and 何华勇（Johnson He） 摘要 当今电子制造中，保形涂覆（Conformal Coating）已不可或缺,但受制于基材表面自身特性，抗浸润（Dewetting）、附着力差(Poor Adhesion)和剥离(Delamination)等工艺瓶颈也日益突显，等离子技术可有效改善材料表面润湿性,提升涂覆附着力和减
