Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
Electronics Forum | Tue Feb 01 09:21:36 EST 2005 | TomA
I looked breafly at this alloy. My concern was that I had already implemented a SAC 305 alloy at SMT. So any of my mixed technology projects would one alloy (SAC 305) on one side (topside) and a different alloy (SN100C) on the bottomside. Most articl
Electronics Forum | Mon Jun 20 21:54:38 EDT 2005 | darby
Contact your paste supplier and see what they say. My information on SAC 305 FROM MY SUPPLIER was - "The cool down rate is not as critical for Pb-free solder joints, as it was for SnPb. The grain sizes do not differ is size in the Pb-free bulk solde
Used SMT Equipment | Soldering - Selective
• Less then 100 hours • Stand-alone Machine • 2 Spray Nozzles/Programable • Dual Solder pots / Dual Heads – Loaded with SAC305 • Heads can run 4 different assembles • Pot level detection / Upgraded self-feeder • Automatic solder refill / Autom
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
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Parts & Supplies | Assembly Accessories
137037 Arcom-8-Channel DEK-CHANNEL-MONIOR-181507 181507 EIDEN Channel TV modulator 121B Furnace temperature teste KIC 2000 profile 9 channel Furnace temperature tester ..KIC 2000 profile 9 channel KIC
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Parts & Supplies | Assembly Accessories
137037 Arcom-8-Channel DEK-CHANNEL-MONIOR-181507 181507 EIDEN Channel TV modulator 121B Furnace temperature teste KIC 2000 profile 9 channel Furnace temperature tester ..KIC 2000 profile 9 channel KIC
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Feb 21 00:00:00 EST 2024 - Wed Feb 21 00:00:00 EST 2024 | Menomonee, Wisconsin USA
Wisconsin Chapter In-Person PCBA Profile Workshop
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Rancho Cucamonga, California USA | Production
The successful candidate will have at least one year experience and knowledge in Pick and Place programming for machines such as Fuji, Samsung, Panasonic, or Tyco; stencil printing and solder past knowledge; wave solder and wave solder washing proce
Career Center | Moorpark, California USA | Engineering
Responsible for the set up of the SMT line, Wave Solder Machine and actual production. Maintain, program and operate line equipment. Troubleshoot and repair equipment, coordinating with vendors when necessary. Develop standards for stencil app
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Lakewood, California USA | Engineering,Maintenance,Management,Production
Quality conscience, detail oriented, manufacturing engineer, with a hands on approach to overall process improvement and development. Motivated with excellent communication skills and a dedicated team player. Qualifications include: � Safety /Diver
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
Dissolution Rate of Specific Elements in SAC305 Solder 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/profile
. Manual Soldering Selective vs. Wave Soldering AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards Contact Us Global Sales
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