New Equipment | Solder Materials
Solder dross has gone from being a cost to be considered by large companies to a very high cost that must be tracked for all who assemble electronic devices.As much as 70% of bar solder can be wasted as solder dross and with SAC 305 now at the $25/Lb
New Equipment | Solder Materials
Solder dross has gone from being a cost to be considered by large companies to a very high cost that must be tracked for all who assemble electronic devices.As much as 70% of bar solder can be wasted as solder dross and with SAC 305 now at the $25/Lb
Electronics Forum | Wed Jan 07 17:39:26 EST 2015 | duchoang
Additional info: I use SAC305 solder paste on Enig PCB.
Electronics Forum | Mon Feb 06 17:19:59 EST 2017 | davef
Evtimov: IDEALS Project was one of the first to talk about componebt and board damage caused by LF soldering temperatures. There's lots of more current stuff on the web. Here's some that may help: * Assessment of Long-term Reliability in Lead-free As
Used SMT Equipment | Repair/Rework
Hakko 485-V12 Soldering Station is a compact soldering system designed for soldering and de-soldering components and connectors on PC boards. Unit includes full pot of SAC 305 No Lead Solder. Solder flow is time-controlled and temperature-controll
Industry News | 2018-03-29 20:48:41.0
SMTA Europe announces Keynote Speaker Ralph Tuttle of Cree, Inc. on High Power LED Solder Joint Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2018-10-18 08:36:26.0
How the modern solder reflow oven works?
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2010-04-29 21:40:37.0
The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.
ALPHA® Preforms with solder paste adds solder volume.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder Effect of Soldering Parameters on Reaction Kinetics and Phase Transformations of SAC 305 Solder As technology becomes increasingly reliant
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-iron-tip-temperature
. As for the alloy being used, the 63/37 is liquidus at 183C and the new RoHS alloys, such as SAC305 and Sn100C have a liquidus temperature around 215C
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. The solder paste, components and the board metallization used in the experiment are shown in Table 2. Table 1. Experiment matrix SAC305 230 240 250 Peak Temperature (°C
