Industry Directory | Manufacturer
Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
New Equipment | Solder Materials
FCT Assembly Fluxes are designed to be used with both SN100c and SAC305 alloys. By combining our latest flux tecnologies with SN100c, FCT Assembly has an advantage over all other suppliers in paste, wire and flux. FCT Assembly Flux Comparisons:
Electronics Forum | Fri Apr 20 09:23:45 EDT 2012 | kkay
Only at our selective solder process.
Electronics Forum | Mon Apr 16 11:10:13 EDT 2012 | kkay
We are thinking of switching over from sac305 to sn100. Has anyone had any experience with this changeover and is there any drawbacks to switching to sn100?
Used SMT Equipment | SMT Equipment
Many Fuji Sparr parts for sales.. No Part No. Description Qty. Machine 1 GPH4580 HOLDER 7 CP43 2 MPH0472 PISTON 19 CP43 3 GPL1200 PIN 8 CP43 4 S1046A CIR-CLIP WR19 10 CP43 5 PPQ1020 PIN,LOCATING 1 CP43 6 GXT2333 HOLDER,PIN 2 CP43 7 MPA5031 COLLAR 2 C
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Parts & Supplies | General Purpose Equipment
WBSHELL12, WBSHELLINNER12, WC12S, WCB12, WCB12PB, WCC12S/BOX, WCE12, WD40 12 OZ, WDP12, WDP12-WELLR, WDPSPK12, WDT12, WDT12A, WDT12A-WELLR, WEE12, WEE12J, WEE12K, WEEVL12 MICROHENRYS, WEH12, WEKI12V, WF12R, WF12S, WG-12 BLK, WG-12 RED, WH-H-12, WH-S-
Parts & Supplies | Other Equipment
C20-CPU84-E C200H-CPU01 C2000HCPU01E2V C2000HCPU0IE2V1 C200H-CPU02 C200H-CPU03 C200h-CPU11 C200H-CPU21 C200HCPU3E2 C200H-CPU31 C200HCPU31E2 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CP
Technical Library | 2016-09-01 16:21:11.0
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As a result, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently. Our previous study showed that many alternative low silver solder paste materials had good printing and wetting performance as compared to SAC305 solder pastes. However, there is lack of information on the reliability of alternative alloy solder joints assembled using alternative low silver alloy solder pastes.In this paper, we will present the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes after thermal cycling test (3000 cycles, 0°C to 100°C). Six different lead-free pastes were investigated. SAC305 solder joints were used as the control. Low and no silver solder pastes and a low temperature SnBiAg solder pastes were also included.
Technical Library | 2008-03-31 21:35:36.0
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
TI New and Original SN65HVD3082EDR in Stock SOIC-8 package TI New and Original SN65HVD3082EDR in Stock SOIC-8 package TI New and Original SN65HVD3082EDR in Stock SOIC-8 package TCMD1000 VISHAY TCMT1100 VISHAY TCMT1600 VISHAY UF4007 VISHAY US
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
) SnPb 195 205 215 TAL (sec.) 30 60 90 Table 2. Solder Paste, Components, and Board in the Experiment Solder Paste Components & metallization Board metallization SAC305, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-lead.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Lead Free Solder Paste Dispensing & Leaded Solder Paste Dispensing Lead Free Solder Paste Dispensing vs
