Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
European supplier of Lead Free solder products like the paste compositions SnZnAl (low melting point), SAC, SnBi, flux, BGA Balls, solder wire, N2 Reflow Systems.
Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
Succinic anhydride Cas : 108-30-5 Appearance: White flake Purity: 99%min Heavy metal: 20ppm max Melting point: 118-120℃
New Equipment | Solder Materials
Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃
Electronics Forum | Tue Sep 12 08:39:38 EDT 2017 | jefri_simorangkir
we are turning on the printer, suddenly the printer is off after checking there is solderball on pad capacitor component 0603 our question is what can a solderball stuck on one pad can when melting and causing shortsolder (being connected with other
Electronics Forum | Fri Nov 05 15:44:50 EST 1999 | Tim Jensen
Brian, 96.5Sn/3.5Ag is eutectic at 221 C 95Sn/5Ag has a melting range of 221 - 240 C Hope that helps you out...
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Parts & Supplies | Pick and Place/Feeders
SMT basic process components include: silk screen (or dispensing), placement (curing), reflow soldering, cleaning, testing, repair 1, silk screen: its role is to paste or patch solder paste printed on the PCB pad, the components f
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Technical Library | 2007-11-01 17:16:07.0
This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles, conducting polymers, and low melting point (LMP) fillers for z-axis interconnections, especially as they relate to package level fabrication, integration,
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
Link: https://www.ascen.ltd/Products/mask_making_machine/ automation medical face mask machine with inner loop welding is automatic from material feeding to mask collection 1.high automation with PLC, photoelectric detection for the raw material feed
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, July 1, 2015, Subscribers: 22,969, Members: Companies: 14,445, Users: 38,464 Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi Joseph M. Juarez, Michael Robinson, Joel Heebink; Honeywell International
| https://www.eptac.com/do-you-know-all-of-the-applications-for-soldering/
. Different Types of Soldering Soft Soldering (90 °C – 450 °C) [194 o F – 842 o F] This process uses the lowest filler metal melting point of all of the soldering types
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/creep-test
. As a rule of thumb, creep is important for temperatures above half the materials absolute melting point. For solder room, temperature (20°C = 293K
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