New Equipment | Wave Soldering
Maximizes Yields and Reduces Rework The ECD Fluxometer® maximizes yields and reduces rework by qualifying your spray fluxer pattern uniformity and top-side-penetration. Improve Process Quality - Eliminate guesswork when it comes to managing the c
Harwin's range of EMC shielding products improve PCB layout by eliminating the need for soldering cans to the board. This wide range of products are suitable for every stage of your process, from prototyping through to volume manufacturing. Free Sa
Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW
Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig
Electronics Forum | Mon Nov 20 10:40:35 EST 2006 | SWAG
Thanks Mark and Dave. It sounds like our board design and problem areas are similar to yours, Mark. We talked with our customer about the grid pattern but I'm not sure where we are at with that. In reference to the Tg/Td thread, the material is a
Industry News | 2012-11-30 08:40:53.0
IPC has strongly urged the government to clarify International Traffic in Arms Regulations (ITAR) controls on printed boards through explicit enumeration on the USML.
Industry News | 2017-09-20 14:58:07.0
World printed circuit board (PCB) production reached an estimated $58.2 billion in 2016, up 2.2 percent in real terms, while North American PCB production decreased a mere 0.1 percent, according to IPC’s newly published World PCB Production Report for the Year 2016. The North American PCB market also continued its downward trend, but at a slowing rate of just -1.7 percent in 2016, based on data published this week in IPC’s 2017 Annual Report on the North American PCB Industry.
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Parts & Supplies | Assembly Accessories
FUJI NRG1022 CAP FUJI NRG1040 NUT FUJI NRG1060 LOCK FUJI NRG1061 HOLDER, CAP FUJI NRG1070 CAP HOLDER FUJI NRG1072 HOLDER, CAP FUJI NRG1080 HOUSING FUJI NRG1081 HOUSING FUJI NRG1090 SPRING FUJI NRG1110 GUIDE FUJI NTB1830 BEARING THRUST
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
Technical Library | 2013-05-30 17:33:26.0
This paper covers the following topics: The Measurement Application, Measurement Requirements, Measurement Problems, Measurement Results, Reference Samples, Conclusions
Technical Library | 2023-04-17 21:17:59.0
The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.
EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express May 30, 2013, Subscribers: 26133, Members: Companies: 13389, Users: 34754 Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence by: Michael Haller, Volker Rößiger
GPD Global | https://www.gpd-global.com/pdf/doc/FLOware-Base-Locations-Reference-Guide-22100025.pdf
., mount positions for valves and tools) at the desired location. HINT: An ideal XY location minimizes travel time, being as close to the calibration station and processing action as feasible without physically interfering with the next board loading
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/cross-reference-vendors_topic2660.html
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