Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions
AllSurplus is the world's leading marketplace for business surplus, ranging from heavy equipment and industrial machinery to electronic manufacturing and aerospace surplus. A scalable platform to manage buying or selling surplus.
Industry Directory | Manufacturer's Representative
We determine your current and future needs. Our scalable solution grows with you. We look after and maintain your systems. You have quick access to spare parts and services. We are a Heller Industries Rep.
Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Tue Sep 02 19:00:00 EDT 2008 | jlawson
Another software provider for MSL/MSD Management is Valor's vManage Software MES system.... is scalable so can implement just MSD Management if this is all you need. Can be implemented to even stop SMT equipment and warn operators in real time when
Electronics Forum | Mon Feb 27 20:17:54 EST 2006 | SJ
Could anyone kindly share any good/bad experiences that they have with their MRP / ERP systems in a small-mid size contract manufacturer environment? We've been using DBA Classic but is looking for a more scalable, robust system. Our main concern i
Used SMT Equipment | Chipshooters / Chip Mounters
sFAB-D machines have continued to evolve since their release to the market. They are able to insert parts into various panels with a wide range of support in part packaging. As an entry model, sFAB-SH machines are now added into the same product line
Used SMT Equipment | Chipshooters / Chip Mounters
Freeing up more floor space with its compact design and reduced lengthThis is an all-in-on machine with scalability and the ultimate level of versatility necessary for increasing productivity for high-mix production.It features functions for performi
Industry News | 2003-04-22 09:33:13.0
Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
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Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Provide the best machine configuration for customers: NXTII is the only machine with a true modular concept. It is possible to freely install a combination of units such as a work head or a component supply unit and a transpo
Parts & Supplies | In-Circuit Testers
FOR SALE: Keysight 3070 ICT Series 3 or Series 5 Available Now! Unlock the full potential of your testing capabilities with the Keysight 3070 In-Circuit Test (ICT) system! Additional Offer: • Replacement/Exchange (R/X) Service Contracts: SAVE CA$H
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Events Calendar | Tue Jul 16 00:00:00 EDT 2024 - Tue Jul 16 00:00:00 EDT 2024 | ,
Arizona/Sonora & San Diego Joint Chapter Webinar: The Data Revolution Within SMT Manufacturing
Career Center | Tewksbury, Massachusetts USA | Engineering
Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Today we continue to grow and serve customers in an expanding variety of industries. What we do impacts the future of tech
46877 | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/conformal-coating-materials/conformal-coating-scalable
ASYMTEK Products | Nordson Electronics Solutions
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ALTERA&PN=EP1SGX25DF1020C7
! customer login required - 1 credit Status: Active Mounting Type: Surface Mount Logical Description: IC, Stratix Gx High-Speed Serial Transceivers with a Scalable, High-Performance Logic Array Physical Description: Ball Grid Array (BGA), 1.00 mm pitch, square; 1020 pin, 33.00 mm L X 33.00 mm W X
