Industry Directory | Manufacturer
Michmas Electronics Ltd. provides comprehensive electronic circuit and assembly solutions. From prototyping to full-scale production, we handle project management, PCB production, component procurement, and circuit assembly
SOS Inventory Software provides top-of-the-line inventory control, order management, and manufacturing for a wide variety of industries, plus integration with QBO, UPS, ShipStation, Shopify, BigCommerce, Zapier and PayPal.
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
Electronics Forum | Mon Aug 22 08:54:15 EDT 2016 | bobpan
More than likely the encoder scale or read head has an issue. Many times.. oil/dirt/water get on the scale and cause a bad spot or bad area. Try to clean the scale with a lint free cloth and alcohol. You should also be able to see the read head and m
Electronics Forum | Tue Oct 21 07:14:40 EDT 2003 | Ciara
Hi, I'm a 3rd year studen doing an electronics project on a digital weighing scales, could someone please tell me any useful websites which contain weighing scales schematics or other useful schematics, any help would be greately appreciated, thank y
Used SMT Equipment | Flexible Mounters
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Industry News | 2014-04-11 12:49:57.0
Heller Industries was announced the winner of the Circuits Assembly 2014 Service Excellence Award in the category of Reflow Soldering Companies.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Juki FX1R stop sensor L825E1210A0 Specs: JUKI FX1R stop sensor L825E1210A0: E94677250A0 OUT SENSOR CABLE ASM E94637250A0 IN SENSOR CABLE ASM E94667250A0 C.OUT SENSOR CABLE ASM E94657250A0 STOP SENSOR CABLE ASM E95517250A0 F FEED
Juki FX1R stop sensor L825E1210A0 Specs: E94677250A0 OUT SENSOR CABLE ASM E94637250A0 IN SENSOR CABLE ASM E94667250A0 C.OUT SENSOR CABLE ASM E94657250A0 STOP SENSOR CABLE ASM E95517250A0 F FEEDER FLOATING CABLE ASM E95567250A0
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
E9641729000 MAGNESCALE DETECTOR (30) E964172900A DETECTOR AMP (30) E964172900B SENSOR HEAD CABLE ASM (8M) E9641729A00 DETECTOR AMPLIFIER(30) E9641729B00 SENSOR HEAD(X AXIS 8M) E9641729C00 SENSOR HEAD(Y AXIS 8M) E9641855000 PANEL COMPUTER
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Fri Jan 13 00:00:00 EST 2023 - Fri Jan 13 00:00:00 EST 2023 | Richardson, Texas USA
Dallas Chapter Technical Luncheon: 3D Printing of Tooling and Fixturing for the Manufacture of Electronics
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | South Plainfield, New Jersey USA | Engineering
MacDermid Alpha Electronics Solutions, a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seeking a Jr. Chemical Process Enginee
Career Center | San Diego, Michigan USA | Sales/Marketing
* Results driven Sales Executive combining expertise in Building Sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries * Extensive Field Sales experience with a tra
Career Center | Howell, Michigan USA | Sales/Marketing
Results driven sales executive combining expertise in building sales networks and strategic business development in the Electronic Component, Connector, and Electronic Manufacturing Equipment industries. Extensive field sales experience with a track
array (BGA) and chip scale package (CSP) manufact
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_library-expert-2019-06-released_topic2528.xml
Feature:Fixed an issue where the print PDF feature was only printing the page Header3D STEP:TO220 Vertical – Fixed issues with the 3D Model generation when D1 exceeded DLCC component family STEP Model generation modified so that the pin 1 marker scales better for smaller parts with pin 1 at the edges
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1203-cross-section-showing-voids
. Depth scales are calculated using the speed of ultrasound within the ceramic. In This Section Support Imaging Modes AMI Overview AMI Glossary FAQs Application Notes Standards Publications Literature Search Webinars Seminars Workshops Training Workshops Custom Programs Service
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