Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Industry Directory | Manufacturer
PVA TePla Analytical Systems, a company that designs and manufactures advanced Scanning Acoustic Microscopes for both laboratory and production environments
Used to inspection materials which do not admit x-ray penetration (e.g. ceramics). Also used in device-level inspection for defects and counterfeit detection.
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
Industry News | 2020-09-17 12:23:10.0
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716
Industry News | 2014-05-14 16:54:20.0
A newly released training video, DVD-166C, “Counterfeit Components” from IPC — Association Connecting Electronics Industries®, explains not only how counterfeit components find their way into the supply chain, but more important, how to detect fraudulent devices during visual inspection.
Technical Library | 2017-06-15 00:44:19.0
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
The X-Spection 6000 is our most Technologically Advanced X-Ray Inspection System. As with all X-SCOPE platforms, it includes every advanced s/w tool required for a wide variety of applications. With more tilt and a rotating work table, the X-Spection
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
ASCEN Technology | https://www.ascen.ltd/Blog/Gif/list_57_3.html
machine.uses to manual welding of earbands/earloops.Connect mask with ear loop well by the high-frequency elastic vibration of acoustic system
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
destroying the volume, as would be the case with a traditional cross-section. Of course, the resolution of the CT is not at the same level as that found in a scanning electron microscope (SEM) but the speed of making the CT model is measured in minutes
