Industry Directory | Consultant / Service Provider / Manufacturer / Other
Global provider of Legacy PCB Re-Engineering Systems & Process Control Tools since 1990.
Industry Directory | Manufacturer
Vendor of systems for Automated Optical Inspection (AOI), 3D X-Ray Inspection (AXI)and 3D solder paste inspection (SPI). The company's inline and stand-alone AOI systems won several "Best in Test Awards"
Count On Tools specializes in custom engineered nozzles for all types of LEDs (Cree, Luxeon, Phillips, NIchia, Osram, etc). Recent growth in LED technology and solid state lighting has provided the electronics manufacturing industry with viable sol
Mantis Compact is an ergonomic, low fatigue visual inspection microscope, excelling in the low magnification range for PCB inspection tasks where bench magnifiers have traditionally been used. Featuring Vision Engineering's patented eyepiece-less te
Electronics Forum | Thu Feb 26 09:27:15 EST 2004 | smtprof
How i can adjust sensitivity of scanning unit DP-Axis amplifier ?
Electronics Forum | Fri Feb 27 10:12:36 EST 2004 | stefwitt
The front plate of the S15 head gives you access to the signal amplifier boards. You'll find 4 potentiometers adjusting the voltage and the symmetry of track A and B. A digital scope turned to X+Y provides an image of a circle, which is been adjusted
Used SMT Equipment | Semiconductor & Solar
HITACHI S-3000-N Scanning Electron Microscope (SEM) Not sure of vintage! Full specifications upon request. https://www.karenmadison.com/hitachi-s-3000-n-scanning-electron-microscope-sem/
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Industry News | 2003-04-21 08:46:05.0
Kaisertech has added Meiji Techno microscopes and vision equipment to its range of electronic production equipment.
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Parts & Supplies | Assembly Accessories
FUJI-sw-micro-PZ02394 electron microscope 3.5-90X Magnification HD HDMI/USB 14MP Camera electron microscope 3.5x-90x stereo microscope MICRO EJECTOR UNIT KM8-M7162-00 MICRO PHOTO SENSOR THETA-AXIS J3212027A J3212027A Micro Switch S5
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2014-07-02 16:46:09.0
Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Smart Electronic Shelves Fixed electronic shelf instructions ※ Multi-color LED (set according to the actual needs of customers), support multiple sets of work orders at the same time to prepare materials for delivery ※ double-sided access material ※
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Career Center | Gaithersburg, Maryland USA | Engineering,Production
Test Engineer Design hardware and software solutions required to test data communications products in a low-medium volume, high-mix production test environment. Design and build test fixtures to support these solutions. Support Production Test d
Career Center | Carleton, Michigan USA | Engineering,Sales/Marketing
Proof Of Design, a leading electronics and electromechanical engineering consultancy, needs a very knowledgeable, highly experienced test engineer to join our team for pending contracts. Must have JTAG/Boundary scan experience and the ability to trav
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | GURGAON, India | Engineering,Quality Control,Research and Development
NO
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_hp4500_shield_torch_system.html
: 110 x 60 x 58 cm Weight: 135 kg Mass Filter: Quadrupole hyperbolic rods Mass Range: 2 - 260 Resolution: 0.3 - 2.0 amu discrete dynode electron multiplier Scanning Rate
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/459?order=name+asc
0.0 CNY Electron microscope ¥ 0.00 0.0 CNY Electronic Scale_75KG display with RS232 interface with mainboard ¥ 0.00 0.0 CNY Electrostatic fildmeter ¥ 0.00 0.0 CNY Element ¥ 0.00
