Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of Inspection systems AOI, AXI, THT, SPI Manufacturer and supplier of Embedded Access systems, JTAG, Boundary Scan
New Equipment | Rework & Repair Services
ScanCAD provides comprehensive electronics reverse engineering services, transforming physical printed circuit boards (PCBs), ceramic substrates, and hybrids into complete manufacturing data packages. Utilizing advanced, high-resolution scanning syst
New Equipment | SMD Reel Storage
Smart Electronic Shelves Fixed electronic shelf instructions ※ Multi-color LED (set according to the actual needs of customers), support multiple sets of work orders at the same time to prepare materials for delivery ※ double-sided access material ※
Used SMT Equipment | Semiconductor & Solar
HITACHI S-3000-N Scanning Electron Microscope (SEM) Not sure of vintage! Full specifications upon request. https://www.karenmadison.com/hitachi-s-3000-n-scanning-electron-microscope-sem/
Used SMT Equipment | In-Circuit Testers
SPEA 4040 Flying Probe with Boundry Scan Model: FP 4040 HI-LINE SERIES 5 Flying Probe Tester Year: 2004 S/N: SWE537FF 4040 Hi Line; high speed high accuracy (1) DRIV-10 V/I Generator; Precision Driver, 4Q, +/-10V, +/- 1A (1) Boost-80 V/I Gene
Industry News | 2003-04-03 08:51:07.0
Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming
Industry News | 2009-10-16 16:26:33.0
Everett Charles Technologies, (ECT), a Dover Company and a leader in the development of advanced technology board test products, announced that ECT has finalized a strategic partnership with ScanCAD International of Littleton, CO, USA, a global supplier of process management tools. This partnership provides for ScanCAD International to exclusively distribute and support the ProWorks process management work instruction software family of products globally within the electronics industry.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2015-05-11 21:27:52.0
Originating from the last millenium, almost three decades ago, the introduction of surface mount packaging triggered a wave of changes throughout many aspects of electronics production. A small number of talented, innovative test engineers from various big players of the industry started to attend meetings to discuss the impact of that change of technology on their future test concepts for modern assemblies. The Joint Test Action Group was born.
Smart Electronic Shelves Fixed electronic shelf instructions ※ Multi-color LED (set according to the actual needs of customers), support multiple sets of work orders at the same time to prepare materials for delivery ※ double-sided access material ※
Intelligent SMD Component Storage System Feature •Management is simple ▶Reduce manpower and improve efficiency ▶System control FIFO, eliminate human interference ▶Visual management, lights prompt ingredients, reduce staff Operation requirements •Pro
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Career Center | , | Engineering
We're actively searching for a Senior ICT/Functional Test Engineer with experience in HP3070's, Boundary Scan, Functional design and sustaining that has the ability to become a Test Engineering Manager within 12-18 months.� This position will offer y
Career Center | Carleton, Michigan USA | Engineering,Sales/Marketing
Proof Of Design, a leading electronics and electromechanical engineering consultancy, needs a very knowledgeable, highly experienced test engineer to join our team for pending contracts. Must have JTAG/Boundary scan experience and the ability to trav
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Coral Springs, Florida USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
�Hands on experience with various failure analysis and materials characterization techniques including scanning and transmission electron microscopy, energy dispersive X-ray analysis, mechanical testing with Instron and MTS machines �Working knowledg
SMTnet Express, July 26, 2018, Subscribers:31,208, Companies: 11,001, Users: 24,976 Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly Jun Balangue; Keysight Technologies This paper
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5027
. Cathodic reduction was used to quantitatively determine Ag and Cu corrosion products. Scanning electron microscopy was applied to compare surface morphologies of metal films under various test conditions
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). Introduction The increasing awareness of health risk associated with lead (Pb
