New Equipment | Solder Materials
NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe even without a thermal profile. This gel flux dries within one hour of use with or without heat and is t
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Thu Jul 07 18:07:38 EDT 2005 | saragorcos
Ahh. sorry for the foul up - and thanks for stopping the spread of misinformation!! Sarag
Used SMT Equipment | Repair/Rework
VJ Electronix Benchtop Solder Rework System Vintage: 2013 Model: SRT Micra Micro Assembly & Small Board Rework System High Resolution Vision System Convection Top & Bottom Site Heating Spot Heater 0.3mm Pitch Process Capability 01005
Used SMT Equipment | SMT Equipment
Windows XP operation software with English/Chinese version alternative; whole machine under intergration control can display the list of failure and save all production data for further analysis. External streamline design and modularozed design insi
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2025-07-28 11:04:16.0
The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be held October 19 - 23, 2025 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2013-03-04 16:51:00.0
Chip-scale (or chip-size) packages are rapidly becoming an important element in electronics due to their size, performance, and cost advantages [Hou, 1998]. The Chip Scale Package (CSP) is becoming a key semiconductor package type, particularly for consumer products. Due to their relatively smaller size, new challenges are presented in the rework and repair of CSPs. (...) The specific focus of this paper is the removal process for rework of CSPs and the site scavenging methods required to properly prepare the circuit board for a new component. Process factors such as the heating, fluxing and, atmosphere are discussed.
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
ALPHA® Preforms with solder paste adds solder volume.
SMTnet Express, May 18, 2017, Subscribers: 30,472, Companies: 10,597, Users: 23,256 How to Use the Right Flux for the Selective Soldering Application Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D; Kester The selective soldering application requires
| https://pcbasupplies.com/leaded-solder-wire/
JM-20 Sn63/Pb40 – 1.6 mm No Clean Leaded Flux Cored Solder Wire Login Create Account Contact View My Cart Menu × Categories Hand Soldering
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
: contacting point of Cu and Sn; σCS: surface tension between Cu and Sn; σCF: surface tension between Cu and flux; σSF: surface tension between Sn and flux; W: Sn weight; θ
