Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Industry Directory | Distributor / Manufacturer
AOI Vision is the specialized supplier of advanced materials and engineering solutions for SMT PCB screen printing industry. We team up with industry leaders who are equipped with cutting edge technology and innovative products.
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Used SMT Equipment | Pick and Place/Feeders
SMT Line Equipment Package For Sale consisting of the following items DEK 265 GSX Stencil Printer - Year 1999 Universal 4796L ChipShooter - Year 2000-2001 305+ Universal HSP Feeders of various sizes 16+ Universal HSP Feeder Carts Universal GSM2 - Du
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, eliminating costly rework, scrap and delays. Supports E-form, laser cut, chem etch, hybrid
Career Center | Fremont, California USA | Production
SMT Operator Duties include machine set up and load, parts value verification, screen printing, hand loading, reflowing. Operator is responsible for aligning and hand placing parts on boards and working the reflow oven. Performs basic machine set up
Career Center | San Diego (Mira Mesa), California USA | Engineering
SMT MANUFACTURING (Quality) ENGINEER (Process Engineer) Duties & Responsibilities: Researches, develops and installs SMT processes and equipment necessary to produce high quality, least cost products. Responsible for the identification and elim
Career Center | Bangalore, Karnataka India | Engineering,Production,Research and Development,Technical Support
� Exposure to Siemens Pick & Place M/Cs. � Basic knowledge in POP components, 01005 component package. � Exposure in SIX SIGMA TOOLS � WHITE BELT. � Performing DFM for the new products & running products. � Exposure in scre
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates - I.C.T SMT Machine English Bahasa indonesia Сербия
| http://etasmt.com/cc?ID=te_news_news,26176&url=_print
Stencil Printer Sp 400V , Nitrogen Reflow Oven , Single And Dual Wave Soldering Machines , SMT Scrap Tape Cutting Machine , LED SMT Terminal Insertion Machine , Automatic SMT
.gif)
winsouce.jpg)