New SMT Equipment: second reflow solder connection underfill (10)

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

ProtoFlow S - Lead-Free Reflow Oven

ProtoFlow S - Lead-Free Reflow Oven

New Equipment | Reflow

Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e

LPKF Laser & Electronics

Electronics Forum: second reflow solder connection underfill (33)

TAL during reflow

Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef

'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured

Re: solder joint problem?

Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F

Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr

Used SMT Equipment: second reflow solder connection underfill (1)

Panasonic Panasonic chip mounter CM202

Panasonic Panasonic chip mounter CM202

Used SMT Equipment | Pick and Place/Feeders

=1.0 ±50/Chip Cpk>=1.0 ±35/QFP Cpk>=1.0 ±50/Chip Cpk >=1.0 ±35/QFP Cpk >=1.0 Productive Highest Tact (CPH/sec) 25,000/0.144 19,000/0.189 7,200/0.5 Effectiveness Tact (CPH/sec) 17,000/0.21 14,000/0.26 5,000/0.72 PCB trans

Shenzhen Langke Automation Equipment Co.,Ltd

Industry News: second reflow solder connection underfill (44)

i4.0 Connect Forum - Fremont Marriott Silicon Valley

Industry News | 2019-09-12 22:51:52.0

Learn first-hand the experiences, challenges and solutions our leaders are taking to achieve truly smart manufacturing.

Heller Industries Inc.

How to get real-time thermal data for a PCB?

Industry News | 2018-10-18 10:20:21.0

How to get real-time thermal data for a PCB?

Flason Electronic Co.,limited

Parts & Supplies: second reflow solder connection underfill (1)

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

KIC KIC X5 Thermal Profiler with SPC software and RF capability For Reflow

Parts & Supplies | Assembly Accessories

Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,

KingFei SMT Tech

Videos: second reflow solder connection underfill (10)

Highlights of 2018 - Video Interview Marc Peo

Highlights of 2018 - Video Interview Marc Peo

Videos

i4.0 Today caught up with Marc Peo of Heller Industries at IPC Apex Expo in San Diego, to discuss the IPC CFX initiative. Check out the rest of the CFX Videos from IPC APEX EXPO 2018 here: CFX Highlights: https://youtu.be/Q7_fWK7_zeA IPC Representati

Heller Industries Inc.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Express Newsletter: second reflow solder connection underfill (1037)

Partner Websites: second reflow solder connection underfill (42)

Pin In Paste Solder Paste Dispensing

GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-solderpaste-pininpaste.php

Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Paste Pin-In-Paste Soldering Pin-In-Paste Solder Paste Dispensing Pin-in-Paste for Solder Reflow Technology Solder Paste is used to make the electrical connection between a PCB and component

GPD Global

SMT Reflow Oven | PCBA Process-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/cc?ID=te_news_bulletin,10161&url=_print

| PCBA Process SMT Reflow Oven | PCBA Process   What is a PCB? PCB=printed circuit board, also known as printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components


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