Electronics Forum | Wed Jun 15 08:45:25 EDT 2011 | edmaya33
check your reflow chain. it maybe vibrating causing DPAK to fall at second reflow.
Electronics Forum | Tue Feb 11 07:35:03 EST 2020 | dontfeedphils
If all else fails, you can always chipbond the part. Would it be possible to run this side as the second reflow?
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Technical Library | 2019-05-15 22:26:02.0
As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/5309.html
EQUIPMENT Equipment Accessories REFLOW FURNACE MPM DEK Rehm HELLER OTHER PARTS CONTACT US SURFACE MOUNT SYSTEM Product number:03113144-01 Description
| https://www.eptac.com/faqs/ask-helena-leo/ask/reliability-of-reworked-lead-free-assemblies
. I know this was incorrect, but that is the way we used to do it. This allowed us to fabricate the board with a fused tin/lead electroplate, (1 reflow cycle), wave solder (second reflow cycle
