Electronics Forum | Wed Aug 23 16:40:30 EDT 2000 | Dr. Ning-Cheng Lee
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coar
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. The bottom component of the large board is easily dropped during the second reflow process, or the bottom solder joint is partially melted, causing solder joint reliability problems
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