New Equipment | Industrial Automation
Contact us if the item you are urgent.Often we have large stack to meet you needs ! mailto:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 . 6 Mo
New Equipment | Industrial Automation
Contact us if the item you are urgent.Often we have large stack to meet you needs ! mailto:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 . 6 Mo
Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino
Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte
Electronics Forum | Mon Jul 18 13:34:31 EDT 2005 | jzaccari
Francisco, You need to be concerned about "lead-free" BGAs. The SAC balls will not reflow at at standard tin-lead process temps. I have seen many examples where this has been a very big problem. In once case the BGAs just poped-off when the board was
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Technical Library | 2020-03-19 00:23:15.0
In this study, the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids, such as solder paste and conductive adhesives. The goal of this study was to develop a general method for hypothesis testing when robustness tests are performed. The main problem was to determine if there was a statistical difference between two means or proportions of jet printing devices. In this study, an example of jetting quality variation was used when comparing two jet printing ejector types that differ slightly in design. We wanted to understand if the difference in ejector design can impact jetting quality by performing robustness tests. and thus answer the question, "Can jetting differences be seen between ejector design 1 and design 2"?
Welcome to this Defect of the Month video on simple solderability testing, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years th
The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/designators_topic1622_post6620.html
: 113 Post Options Post Reply Quote JJonas Report Post Thanks(0) Quote Reply Posted: 28 Mar 2015 at 3:58pm Ok, thank you. Can you please provide any examples (part numbers
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/news-search/2017-09-04-five-decades-of-gluing-sealing-and-coating
. Simply stated, it deals with everything that has to do with packaging. Examples include applications in the automotive and automotive supplier industry, hygienic articles, furniture manufacturing and the graphic arts industry
