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Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
SMT XTRA is a global electronics specialist, providing productivity enhancing solutions for the global Surface Mount electronic assembly sector.
Industry Directory | Manufacturer
Rommtech-3S is your partner for reliable and cost effective contract manufacturing!have more than 15 years experience in the production of electronic and electromechanical devices � security products, radiators; cash registers manufacturing; igniters
Ersa SMT Reflow Oven HOTFLOW 4/26 Max. PCB width: 560 mmHeating Zones: 26 zonesThrough Put: 352PCB/hourWeight: 2800KGDimension: 7100x1410x1500mmPower: 400 V / 3 / N / PE - 50 Hz / 60 Hz Ersa SMT Reflow Oven HOTFLOW 4/26 Ersa SMT Reflow Oven H
Features: 1. Totally meet various requirements for the lead free processing. 2. WindowsXP operation system, Chinese/English can be swtiched online. 3. Standard air oven, Patent air system, using hot air convection conduction heat faster, more efficie
Electronics Forum | Mon Oct 14 00:05:50 EDT 2013 | felo188
Some ideas?
Electronics Forum | Tue Oct 01 14:53:24 EDT 2013 | felo188
it's means that a pcb part responsible for second top zone is broken. To make sure i changed second thermocouple and heater with first. Now there is no overshoot. But I have still problem with automatically shutdown. It is turning off after 1 or 2
Used SMT Equipment | Soldering - Reflow
1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242
Used SMT Equipment | Soldering - Reflow
2004 BTU Pyramax 150N X5 Reflow Oven 10 Zones (Top and Bottom Side Heaters) 2 Cooling Zones Edge Rail & Mesh Belt 7819 Operating Hours Nitrogen Capable Power: 380 / 220VAC; 3 Phase; 119A Machine Dimensions: 260" x 60" x 65"
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Parts & Supplies | SMT Equipment
XMP card of KE2050 Professional maintenance JUKI SMT various circuit boards: JUKI CPU motherboard, SUB-CPU board, laser control board, servo drive card, X / Y / Z / Q-axis drive, 24V power supply card, head boards, image control card, I / O board
Parts & Supplies | Assembly Accessories
HELLER REFLOW MOTOR CP6383 CBM-9230 Capacitor -run induction motor Model Number CBM-9230 CP6383 Input Voltage 210-240V Frequency 50/60 Hz Power 83W
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Flowery Branch, Georgia USA | Production
Ideal candidate must already be located in Atlanta metro area and have significant experience programming and operating Siemens F-15 and S-20 SMT, Reflow (Seho experience a plus) and Wave-Solder (Seho expererience a plus). Lead and RoHS experience re
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Heller Industries Inc. | https://hellerindustries.com/power-electronics/
. As a result, void-free solder joints and connections are now a must. Vacuum assisted reflow remains one of the best methods for achieving void free solder connections, and is widely used in the power device packaging industry
| http://www.feedersupplier.com/sale-13119500-vitronics-mr933-smt-reflow-oven-parts-lrs-350-24-mw-power-switch.html
Vitronics MR933 SMT Reflow Oven Parts LRS-350-24 MW Power Switch Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
