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Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
SMT XTRA is a global electronics specialist, providing productivity enhancing solutions for the global Surface Mount electronic assembly sector.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Equipment Broker - Used - SMT specialists - Quality Manufacturing Equipment Bought and Sold - Zevatech/Juki /MPM Specialists.
Ersa SMT Reflow Oven HOTFLOW 4/26 Max. PCB width: 560 mmHeating Zones: 26 zonesThrough Put: 352PCB/hourWeight: 2800KGDimension: 7100x1410x1500mmPower: 400 V / 3 / N / PE - 50 Hz / 60 Hz Ersa SMT Reflow Oven HOTFLOW 4/26 Ersa SMT Reflow Oven H
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
Electronics Forum | Tue Oct 01 14:53:24 EDT 2013 | felo188
it's means that a pcb part responsible for second top zone is broken. To make sure i changed second thermocouple and heater with first. Now there is no overshoot. But I have still problem with automatically shutdown. It is turning off after 1 or 2
Electronics Forum | Fri Nov 30 17:33:12 EST 2001 | slthomas
After saying for years that we'd never do two-sided assembly, the powers that be are not only saying we will, but they're threatening to throw an out of house design at us...no frame (it's a PCI card with a couple of dinky breakaway tabs), no tooling
Used SMT Equipment | Soldering - Reflow
1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242
Used SMT Equipment | Soldering - Reflow
2008 Vitronics Soltec XPM2-730 Reflow Oven Power: 220V; 50/60Hz; 3 Phase Direction: Left to Right Serial: X2A72005 Features: 7 Zones (Top & Bottom Heaters) OS: Windows XP; S/W: 3.2.0 Lead-Free Compatible; Auto Width Adjust Combo Mesh Belt / Pi
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2015-07-28 10:36:48.0
EMS provider Canadian Inc. Energy Group in Laval, Quebec; Canada will be liquidating some of their excess and unused assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 8:00am EST on August 10, 2015 and the closing will begin at 1:00pm EST on August 12, 2015.
Parts & Supplies | SMT Equipment
XMP card of KE2050 Professional maintenance JUKI SMT various circuit boards: JUKI CPU motherboard, SUB-CPU board, laser control board, servo drive card, X / Y / Z / Q-axis drive, 24V power supply card, head boards, image control card, I / O board
Parts & Supplies | Assembly Accessories
KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Huntington Beach, California USA | Production,Technical Support
Creating and updating programs for pick and place equipment Setup of Screen Printer Setup of pick and place machine Creating profiles for reflow oven Setup for AOI Review and interpret customer drawings Qualifications: Knowledge of NASA-8739, J-S
Career Center | Crawfordsville, Indiana USA | 2015-06-08 15:47:37.0
Requisition: 1705 Job Title: Process Engineer Company Summary: Acuity Brands, Inc. is a North American Market Leader and one of the world's leading provideres of lighting solutions for both indoor and outdoor applications. Our Crawfordsville Faci
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
Heller Industries Inc. | https://hellerindustries.com/parts/581873/
581873 - Panel, Power Switch Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
| http://etasmt.com:9060/te_product_j/2011-09-19/2430.chtml
Number of Cooling Zones 2 3 Control System PLC+Computer PLC+Computer Transmission Agent Chain + Mesh Chain + Mesh Max.Width Of PCB 460mm 460mm Power For Warm Up 45kw 55kw Power Consumption 8kw 10kw Conveyor Height 900+/-20mm 900
