Industry Directory | Standards Setting / Certification / Training Provider / Consultant / Service Provider / Manufacturer
BEST is a certified master IPC Training and Solder Certification center. We provide comprehensive courses for both Instructors and Operators including IPC-A-610, IPC J-STD-001, IPC-A-600, IPC/WHMA-A-620, and IPC 7711/7721 standard
Industry Directory | Manufacturer
Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer
New Equipment | Rework & Repair Equipment
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
New Equipment | Rework & Repair Equipment
BEST circuit frames come in both dry film and epoxy versions. We can produce circuit frames in 1 and 2 oz copper as well as with shiny tin or nickle gold coating. These circuit frames are microetched on the board side in order to insure better adhesi
Used SMT Equipment | Screen Printers
New arrival - 2023 DDM Novastar, SPR-45 Gold-Print Solder Paste Screen Printer, functionality is not applicable to consumables such as Printing Blades and Stencils. 23x23 Max Stencil Size. New arrival. Contact us for more information - AssuredTechnic
Industry News | 2016-10-10 10:59:34.0
Sypris Electronics will be liquidating some of their assets utilizing the online auction services of Baja Bid. The bidding for this event will open promptly at 7:00am EDT on october 24, 2015 and the closing will begin at 11:00am EDT on November 11, 2016.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
Events Calendar | Tue Apr 19 18:30:00 UTC 2022 - Tue Apr 19 18:30:00 UTC 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Events Calendar | Tue Mar 17 18:30:00 UTC 2020 - Tue Mar 17 18:30:00 UTC 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | Toronto,, Ontario Canada | Engineering,Research and Development
DEBTANU BASU 40 Fountain Head Road Toronto, ON M3J2V1 (416) 514 0619 Cell: 416 258 7488 E-mail: debtanubasu@aol.com With more than six years of experience in the field of flip chip technologies seeking a challenging technical position in the field
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I.C.T ROUTER GOLD-Trade Info-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> Trade Info I.C.T ROUTER GOLD I.C.T ROUTER GOLD This machine is required at the final stage of SMT line to cut a Panel into Modules
Baja Bid | https://bajabid.com/february-23-28-2023-online-auction/
Falcon 1200 Reflow Furnace, Mydata MY15E Pick & Place, Mydata MY12E Pick & Place, Mydata M8 Magazines, Mydata LM1216 Magazines, Assorted Mydata Feeders, Universal GC-120 High Speed Chip Shooter, Universal Feeder Trolleys, Universal Gold Feeders, MPM Momentum Screen Printer
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