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Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
High-density interconnection/HDI PCB Layer: 8 (HDI) Structure: 2+4+2 with stack via Material: FR4(Tg170) Thiness: 1.0mm Surface treatment: Selective immersion gold + OSP Blind via L1-2 & L2-3 & L6-7 & L7-8: 0.1MM (4mil) Buried via L3-6:
Electronics Forum | Fri Aug 20 00:11:05 EDT 1999 | Rick Holmes
Anyone out there using OSP with double sided reflow and selective solder pallets? I am having trouble testing through what is left of the Entek Plus on the test pads.
Electronics Forum | Fri Aug 20 05:17:25 EDT 1999 | Earl Moon
| Anyone out there using OSP with double sided reflow and selective solder pallets? I am having trouble testing through what is left of the Entek Plus on the test pads. | Think rotary. Earl Moon
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2011-04-20 21:19:17.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 1
Events Calendar | Tue Apr 13 00:00:00 EDT 2021 - Tue Apr 13 00:00:00 EDT 2021 | ,
Boston Chapter Webinar: Cleaning Chemistry For PWB and Rework - Part 2, session 2
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
| https://pcbasupplies.com/alloy-solder-paste-enig/
& Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
