Industry Directory | Manufacturer's Representative
SMT assembly equipment including placement, reflow & vapor phase soldering, cleaning, X-Ray, AOI, SPI, conveyors. First Article Inspection (FAI). Consumables, splicing systems & tools, splice tape & clips. Understencil wiping Roll
New Equipment | Wave Soldering
PCB wave soldering machine HR-300E: 1. PLC and touchscreen controlling system which can save more than 50 sets parameters. User-frienly interface is easy to be operated,temperature can be set/saved/modified in touchscreen. 2.The high quality spraye
New Equipment | Selective Soldering
On-line DIP Selective Wave Soldering Machine Our online selective wave soldering machines are the perfect solution for businesses that need to perform high-precision soldering on PCB assemblies. Our machines use a unique wave soldering process that
Electronics Forum | Fri Nov 14 10:45:22 EST 2014 | tombstonesmt
We use both types in house. We started with a board moving over the pot, slowly moved on to Jade machines and eventually Synchrodex. Like you mentioned without palletizing you'll have component movements during the cylce and most likely won't have th
Electronics Forum | Fri Nov 14 09:47:19 EST 2014 | jpal
Thanks for all the remarks. I am tending toward the move the pot method. I am concerned about parts tilting from square if moved or held at an angle. I won't need to deal with board pallets, board clamp mechanisms, etc. Plus I found the moving board
Used SMT Equipment | Soldering - Selective
Vitronics Soltec mySelective 6745 Selective Solder Model: mySelective 6745 Vintage: 2010 Details: Lead Free Solder Pot 400 VAC 10 kVA 410mm x 410mm Standard Gripper Preheater with 9 Elements Pressurized Flux System Solder
Used SMT Equipment | Soldering - Selective
Max PCB or pallet size 310 x 410 mmMax PCB weight 10 kgSolder pot volume MW 180 kg / SW 45 kgMax soldering area 250 x 350 mmN2 consumption 75 L/minMaximum components height top side 120 mmPower supply 3 x 400V 50/60 HzCjhmhbg00wMachine size (L x W x
Industry News | 2020-04-14 22:14:18.0
ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.
Industry News | 2012-03-09 17:47:15.0
IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
SMTnet Express, June 7, 2018, Subscribers: 31,097, Companies: 10,956, Users: 24,801 Potting Under Vacuum or Atmosphere? Scheugenpflug; Scheugenpflug Inc. Potting under vacuum or atmospheric conditions? This question about the correct procedure
The Effect of Coating and Potting on the Reliability of QFN Devices. Online Version SMTnet Express, August 28, 2014, Subscribers: 23150, Members: Companies: 14012, Users: 36727 The Effect of Coating and Potting on the Reliability of QFN Devices
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/solder-pot-service-cart
. - Compatible with all Nordson SELECT Novo ® , Cerno ® and Integra ® selective soldering machines equipped for service cart. Overview. The Solder Pot Exchange and Service Cart can be used for servicing solder pots or for rapid exchange of solder pots with different solder alloys
GPD Global | https://www.gpd-global.com/co_website/news-events-pr-526.php
Fluid Dispensing for Large PCB, Pallets Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
