High Tech, Quick Turn, Manufacturer of PCB's up to 44 layer count. Specializing in Prototype and R&D. Mil-Spec 31032 & 55110 Certified. Located in Fremont, CA & Amesbury, MA.
Industry Directory | Manufacturer
Professional, Reliable,High Quality,Low Cost, Rapid Delivery PCB manufacturer
1. Smooth cutting finish only by router cutting . 2. There is little distortion on PCB during cutting because using high-frequency spindle motor . It is 1 / 10 of pressing , 1 / 100 of breaking by hand . 3. One-touch program changeover . 4. Able to c
Features: 1. Smooth cutting finish only by router cutting . 2. There is little distortion on PCB during cutting because using high-frequency spindle motor . It is 1 / 10 of pressing , 1 / 100 of breaking by hand . 3. One-touch program changeover .
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Technical Library | 2017-09-07 13:56:11.0
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Tue Apr 19 18:30:00 UTC 2022 - Tue Apr 19 18:30:00 UTC 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | Clarksburg, Maryland USA | Engineering,Management,Research and Development,Technical Support
We are currently seeking a Senior Manufacturing Engineer for our Clarksburg, Maryland location. The candidate must be driven with a strong ability to multi-task under pressure. Responsibilities: The successful candidate will be responsible for:
SMTnet Express, October 10, 2024, Subscribers: 25,836, Companies: 12,282, Users: 29,256 █ Electronics Manufacturing Technical Articles Brief description of ENIG for Multilayer PCB ENIG (Electroless Nickel/Immersion Gold) is to deposit
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
| http://www.thebranfordgroup.com/dnn3/Auctions/RecentAuctions.aspx
[Available for Immediate Sale] SOLD - 2019 Agilent 7890B Gas Chromatograph System w/ 5977B GC/MSD Mass Selective Detector Rochester, NY Ward-Jet Model Z Series 2043 [Online
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