Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Fri Sep 10 17:18:10 EDT 2010 | spitkis2
They may be misaligned so much so that self centering would not occur. How are you placing the micro BGA's? Depending on how the boards are transported onto the oven's conveyer, by the time they start to go through the oven, there could be additio
Electronics Forum | Mon Jan 09 17:52:50 EST 2023 | duchoang
The reasons could be: -The pads size are uneven. Modify the pads size. -The part has not enough time for self-centering. Check and increase TAL. -Solderpaste not melted completely. Increase peak temp. -Solderpaste does not work well. Use alternate so
Industry News | 2008-04-10 21:33:27.0
Market-leading electronic materials company, Henkel Corporation, continues to prove its commitment to developing inventive and process-enhancing materials technologies and last week this effort was recognized as the company received three prestigious awards during the APEX event in Las Vegas.
Technical Library | 2021-09-15 18:53:20.0
Many printed circuit board assemblies (PCBAs) have relays that are soldered to the PCB. If such an electromechanical component fails, it can cause the whole device to fail, just like any other electronic component. The spectrum of root causes that lead to an increased contact resistance or a complete contact failure is totally different from what usually occurs in the electronics domain. This article provides a detailed analysis of these failures and the corresponding root causes, many of them self-centering.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/self-cleaning-powder-feeding-centers?con=t
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Surface Mount Technology Association (SMTA) | https://www.smta.org/LED/accommodations.cfm
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