Industry Directory | Manufacturer
A leader in automated fluid dispensing, jetting, and conformal coating. Products include stand-alone dispensing workstations and fully automated, in-line conveyorized systems with advanced process controls.
The primary activity of the company is to provide OEM services to customers who would like to outsource the semiconductors package design and manufacturing activities.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow
Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f
Used SMT Equipment | Semiconductor & Solar
Very Nice Thermotron Test Chamber For Sale Thermotron Model Number: SE-600-6-6 Serial Number: 31362 Allen Bradley 1305 Controller Interior Dimensions: 40" x 26.25" x 34" Cascade Compressor System Temperature Range: -70C to 180C Temperature
Used SMT Equipment | Semiconductor & Solar
Yaskawa Wafer Robots Very Nice Package of Yaskawa Robots For Sale All items such as Robots, Controllers, Slide Stages, Controls, Cables, Accessories shown in pictures are included. They are in New Condition and never put into production Robo
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2011-02-17 15:04:54.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.
Parts & Supplies | Pick and Place/Feeders
The definition of SMT SMT is the surface assembly technology,surface mount technology(surface mount technology)(Surface Mounted Technology abbreviation),is currently the most popular electronic assembly industry,a technology and technology. What a
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Why you should attend International Wafer-Level Packaging Conference, October 23 - 25, 2018 in San Jose, California, USA.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Tue Oct 13 00:00:00 EDT 2020 - Thu Oct 15 00:00:00 EDT 2020 | San Jose, California USA
International Wafer-Level Packaging Conference (IWLPC)
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | Santa Cruz, California USA | Research and Development,Sales/Marketing
Project and Application Development Manager. Seeking seasoned project manager, with communications ability, sales savvy and experience with wafer singulation, lasers, or semiconductor packaging. Role will encompass all aspects of project management
Career Center | BANGALORE, India | Engineering,Management,Production,Purchasing,Quality Control,Sales/Marketing,Technical Support
With an experience of 5 years well verse in technical skills of electronic component procurement, knowledge in both hardware and SMT production with process, quality approval, IPC Standards, data sheet reading,analyzing ability,process and people man
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, January 28, 2015, Subscribers: 22,279, Members: Companies: 14,195 , Users: 37,607 BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications Vern Solberg, Ilyas Mohammed - Invensas Corporation
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/interstitial-ball-grid-array-package-ibga_topic3149_post12520.html
. This is where the balls are in a diagonal pattern rather than in simple in-line rows and columns. I have just come across the package with an NXP Semiconductor
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