Industry Directory | Manufacturer's Representative
When it comes to packaging, Tycoon Packaging is your one-stop shop. We offer various custom packaging solutions for businesses of all sizes, from small startups to large corporations.
BGA, SMD & thru-hole assembly, desoldering, rework & repair systems. Fume extraction and filtration systems. Training videos and services.
Advanced Automated Optical Inspection equipment utilizing �Line Sensor Scanning� not the common strobe/camera technology. BF Series inline system offers post paste, bond, place and reflow inspection. The �Hero� off-line bench top model is also avai
Electronics Forum | Fri Nov 07 12:57:36 EST 2003 | microwave
Hi, Help :( I need manuals and instructions for Panasert MK I Model No NM-2562 Prod.No KAAA-629 Ser.No 80800155
Electronics Forum | Sat Sep 05 02:34:19 EDT 2009 | martinphill
check R-axis mechanical backlash... After checking R Axis Backlash, Coupling. If still the Problem continues. We have the same issues & when we asked Jagadeesh Rajagopalan , he suggested following action item Check the servo Error display. If it i
Used SMT Equipment | In-Circuit Testers
FOR SALE ICT Keysite 3070 Fully Refurbished• High-Speed Fixtured ICT• Quote will be based on your configuration Remember Parker SMT when your teams have NEEDS: SMT or ICT (3070/GR/TER & Flying Prober) or Bench Test equipment or IDLE to sell We
Used SMT Equipment | SPI / Solder Paste Inspection
IP 321 3D SPI inspection Model: NM-TE30E Ser. No.: 40XD0190 Produced: 2012 Actual status : running in production IP 321 3D SPI inspection Model: NM-TE30E Ser. No.: 40XD0056 Produced: 2006 Actual status: Non Functional (uncomplete) as S.P
Industry News | 2008-08-22 17:03:42.0
Richardson, TX (August 19, 2008 � Intel Developers Forum, Booth No. 356)�ASSET� InterTech (www.asset-intertech.com) today announced that it has reached an agreement under which ScanWorks, the company's platform for open embedded instrumentation tools, will support Avago Technologies' embedded instrumentation technology for applications-specific integrated circuits
Industry News | 2015-01-27 13:31:03.0
Mentor Graphics and Key Industry Partners Align Analysis Tools, Methodologies, Models, and Reference Designs.
Parts & Supplies | Pick and Place/Feeders
Samsung original new CN/TN series nozzle
Parts & Supplies | Circuit Board Assembly Products
SAMSUNG J91741032A、J91741041A TWIN_SERVO_BOARD /SM421
Technical Library | 2010-08-05 18:39:39.0
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
For more on HyperLynx: http://www.mentor.com/pcb/xpedition/simulation For more on HyperLynx and SerDes design: http://www.mentor.com/pcb/xpedition/simulate-si/serdes Try HyperLynx PI in the Cloud: http://www.mentor.com/products/pcb-system-design/pr
Contact Us Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product Overview✭ ✭Company Profile✭ MOORE Automation Company has more than 10 years of experiences in supplying
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: DFM, Design For Manufacturing
Career Center | TRIVANDRUM, kerala India | Engineering,Maintenance,Research and Development
System Integration, Software Configuration Project Implementation & Commissioning Installation and Servicing of CCTV,Access Control,Public Address systems, Fire & Alarm Security System, Biometric Attendance System. Language Skills-C, C++,UNIX,LIN
Career Center | Trivandrum, Kerala India | 2013-04-13 01:42:31.0
Installation of CCTV,PUBLIC ADDRESS SYSTEM,FIRE ALARM,ACCESS CONTROL,BIOMETRIC ATTENDANCE SYSTEM, Language Skills- C , C++, LINUX,HTML,Assembly Language.
PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port SParameter Measurements PWB Manufacturing Variability Effects on High Speed SerDes Links: Statistical Insights from Thousands of 4-Port
Heller Industries Inc. | https://hellerindustries.com/parts/301163/
301163 - Cable, mains IEC,D Ser. Cpl (Dansensor Communication Cable) Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/efd/resource-center/solder-frequently-asked-questions
Armazenamento e Manuseio Os recipientes de pasta requerem uma certa orientação durante o armazenamento? Sim. Seringas e cartuchos devem ser armazenados verticalmente com as pontas viradas para baixo
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