To clean up the reel tape wastes problem you have in the automated SMT production, here we are to descrive the latest technology and product availale. "Reel Tape Cutter" frees your burdons of controlling the reel tape wastes in SMT production.
Overview • more than 15. times faster tham standard 80C51 (at the same frequency) • 24 times faster multiplication (12 times division) • user programmable Program and External Data Memory Wait States The DP80390 is an ultra high perform
Electronics Forum | Fri Mar 18 15:02:07 EST 2005 | pmd
Please clarify, Z axis gears (Blades)? The MPM head I believe is what your are asking is driven up and down via a lead screw. The machine gets the zero point from the "HAT" tactile sensor in the table nest. When squegees are installed the blades are
Electronics Forum | Fri Mar 18 18:59:03 EST 2005 | pmd
Sorry I was not familiar with the SPM machine, Disreguard previous response that I sent.
Industry News | 2003-05-08 07:22:00.0
Over 400 contract manufacturers present every aspect of outsource capability.
Industry News | 2003-01-31 09:39:08.0
Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002
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Parts & Supplies | Pick and Place/Feeders
Valve and Ejector for Yamaha chip shooter Solenoid valve series KM1-M7163-20X A010E1-37W blow solenoid valve KM1-M7163-21X A010E1-54W Blowing Solenoid Valve KM1-M7163-30X A010E1-44W Vacuum Solenoid Valve KGA-M7111-H0X A041E1-48W 88X Vacuum Sole
Parts & Supplies | Chipshooters / Chip Mounters
508 pick and place nozzles for JUKI high-speed chip shooter KE-2010/2020/2030/2040 /2050/2060/FX-1 E35017210A0 NOZZLE ASM 101 E35027210A0 NOZZLE ASM 102 E35037210A0 NOZZLE ASM 103 E35047210A0 NOZZLE ASM 104 E35057210A0 NOZZLE ASM 105 E35067210
Technical Library | 1999-05-06 15:14:48.0
To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating.
Technical Library | 1999-08-05 10:34:17.0
This document defines a set of standard test structures with which to benchmark the electrostatic discharge (ESD) robustness of CMOS technologies. The test structures are intended to be used to evaluate the elements of an integrated circuit in the high current and voltage ranges characteristic of ESD events. Test structures are given for resistors, diodes, MOS devices, interconnects, silicon control rectifiers, and parasitic devices. The document explains the implementation strategy and the method of tabulating ESD robustness for various technologies.
Precise coating discrete dots with the DispenseJet DJ-9500. http://www.nordsonasymtek.com
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
| https://www.smtfactory.com/How-to-replace-the-chip-capacitor-of-the-SAMSUNG-Pick-Place-Machine-id3532139.html
we can refer to the data sheet of this chip, which will be given in the data sheet For the parameter range of the surrounding components, we refer to the parameter examples in the data sheet to replace
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0354-flip-chip
defects - Application Note 354 Acoustic image showing incomplete bonding of the solder bumps (red). Sample & Method A Flip Chip package was imaged from the top side
A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.
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Branford, CT USA
Phone: 203-488-7020
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