Vacuum SMT Reflow Oven KC-Z104 PCB: 400mm*350mm 10 heating zones Weight APPROX:2500KG Dimension L6025×1350×1500mm Product description: Vacuum SMT Reflow Oven KC-Z104,China factory manufacturer directly. PCB: 400mm*350mm, 10 heating
The best sulotion for PCB depaneling Avoids problems such as the tin break and damage to the compnent caused by manually bending a plate Avoids the stress produced mechanically by using punch or bending Suitable for cutting of a circle, arc and
Used SMT Equipment | Screen Printers
Description Make: Speedprint Model: SP710 AVI Year: 2014 Type: Screen Printer
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
 teaching box for SM421,411 (2)_11.jpg)
Technical Library | 2019-01-20 22:47:35.0
With the rapid development of the electronics industry, more and more components such as integrated circuits and connectors, relays, power modules, etc. need to be packaged with IC tubes. The anti static ic tubes is actually a kind of pvc plastic(reference to : What are the materials for IC tubes) profile, the size varies with the shape of the installed product, the precision requirement is high, the wall thickness should be controlled within ±0.1mm, and the surface is required to have no impurity spots, smooth and transparent. The IC packaging tubes produced by Sewate Technology Co., Ltd. are extruded. The typical process flow is: extrusion, vacuum adsorption setting, traction, fixed length cutting and directional discharge, deburring, immersion antistatic liquid, drying, testing, packaging and storage
Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
Career Center | Norfolk, Virginia USA | Engineering,Maintenance,Management,Production,Purchasing,Quality Control,Research and Development,Technical Support
Jay Selter Test Engineer / Technician; Formal Education: Schools and Courses completed. BROOKLYN TECHNICAL HIGH SCHOOL, NEW YORK: Electrical engineering design (two year major): Meter design and construction; Transformer design and materials; Moto
| http://etasmt.com/te_news_bulletin/2020-08-19/18761.chtml
. The increase in the assembly density of electronic products and the reduction in the size of components and their pin spacing have made the soldering process of SMA more difficult, and the setting
Heller Industries Inc. | https://hellerindustries.com/heller/vacuum-profile-reflow/
How To Set Up Vacuum Assisted Reflow Profile Home » Heller Blog » Tips for Setting Up an Optimized Vacuum Profile when Using Vacuum Assisted Reflow Tips for Setting Up an Optimized Vacuum Profile when Using Vacuum Assisted Reflow With
