New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
Electronics Forum | Mon Jul 24 23:34:14 EDT 2000 | rzkr438
I am tyring to find out shear force requirement for BGA attached on board .I measured two group for shear force to check underfill process effectiveness on BGA .Two group showed siginificant force diferrence .I am very sure underfill process is effec
Electronics Forum | Fri Mar 30 18:24:12 EST 2001 | davef
There is no test. Beyond the issues that you mentioned that affect shear, an article published in a recent [1/01] "Journal Of Surface Mount Technology" documents that shear is also dependent on the rate of shear. You may be able to contact the auth
Used SMT Equipment | Circuit Board Assembly Products
The product introduction The SM-2009 scissors & pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, it’s improve the PCB’s quality
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2007-03-08 19:31:10.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force.
If you have any inquiry, just feel free to contact bella@qy-smt.com. Compatible Strip Board such as Glass fiber board, aluminum board, etc
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
Shear Force Heller Industries The increasing awaren
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/high-force-test
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Nordson DAGE Home Test Types IGBT shear testing IGBT shear testing Nordson DAGE bondtesters provide high force pull testing (up to 100kg
| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
: Defining Shear Forces for Surface Mounted Components Question: Is there an IPC or other specification that exists explaining the minimum shear force requirements for surface mounted components? Answer
