Industry Directory: shelf life after solderability test (3)

AllPoint Electronics

Industry Directory | Distributor / Manufacturer

AllPoint Electronics is specialized in SMT, PTH, and TEST Equipment and services for electronics industry in Brazilian market. We provide full support for PCB assembly factory implementation, and process consulting

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

New SMT Equipment: shelf life after solderability test (31)

NC-559-ASM No-Clean Solder Paste

NC-559-ASM No-Clean Solder Paste

New Equipment | Solder Materials

High Activity, Completely Odorless, No-clean Solder Paste Exceptional print definition Long stencil life Wide process window Excellent wetting compatibility on most board finishes Low voiding Compatible with enclosed printing

AMTECH

AQUANOX® A4708 - pH Neutral Electronic Assembly Cleaning Chemistry

AQUANOX® A4708 - pH Neutral Electronic Assembly Cleaning Chemistry

New Equipment | Cleaning Agents

AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies. AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX® A4708 is specifically form

KYZEN Corporation

Electronics Forum: shelf life after solderability test (121)

PCBA shelf life

Electronics Forum | Mon Jan 05 18:03:04 EST 2004 | davef

You may struggle finding the information that you seek, because there is so much variability in the design and fabrication of boards. * What is the purpose of such a test? * What product type sees such an use environment? Consider using the guidelin

component shelf life

Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

Used SMT Equipment: shelf life after solderability test (1)

Torch TN360C

Torch TN360C

Used SMT Equipment | Soldering - Reflow

    Intelligent hot air lead-free reflow Oven with six heating-zones TN360C Instruction: 1: Heating system: TN360C adopts high effective nickel-chromium heating tube with advanced technology and Long life service. The hot-air circle system wh

Beijing Torch Co.,Ltd

Industry News: shelf life after solderability test (60)

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

SMTnet

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Technical Library: shelf life after solderability test (5)

EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKELPALLADIUM-GOLD FINISH WITH Pb-BASED AND PbFREE SOLDERS

Technical Library | 2024-06-19 13:59:50.0

The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:

Sandia National Laboratories

Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders

Technical Library | 2022-03-02 21:26:51.0

The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).

Sandia National Laboratories

Videos: shelf life after solderability test (18)

PCB cutting machine , PCB separator , PCB depaneling machine , PCB separation machine

PCB cutting machine , PCB separator , PCB depaneling machine , PCB separation machine

Videos

http://www.pcb-separator.com/plus/view.php?aid=86 ??????????? ???????? ????/LED separating/LED panel separating/PCB depaneling device/???????/online separating

ASCEN Technology

?ETA Industrial Pure Water Machine

?ETA Industrial Pure Water Machine

Videos

​ETA Industrial Pure Water Machine ETA-DI250​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning M

Dongguan Intercontinental Technology Co., Ltd.

Events Calendar: shelf life after solderability test (1)

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,

Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?

Surface Mount Technology Association (SMTA)

Career Center - Resumes: shelf life after solderability test (1)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

Express Newsletter: shelf life after solderability test (1059)

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

Partner Websites: shelf life after solderability test (47)

Solder Products : Frequently Asked Questions | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-frequently-asked-questions

? Recommended storage temperature for solder paste is between 40°F and 50°F (4°C to 10°C). Storage at temperatures above refrigeration will reduce shelf life and voids the guarantee

ASYMTEK Products | Nordson Electronics Solutions

Moisture Sensitive Devices (MSD) Council

Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm

. These internal defects are nearly impossible to detect during the PCB assembly and test process. They lead to a number of failure modes that have a negative impact on manufacturing yields and cause early life failure of the finished electronic products

Surface Mount Technology Association (SMTA)


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High Throughput Reflow Oven
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World's Best Reflow Oven Customizable for Unique Applications
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Smt Feeder repair service centers in Europe, North, South America
Win Source Online Electronic parts

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