Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Industry Directory | Manufacturer
PCB Assembly in Indonesia with ISO Certificate Are you looking for SMT and PCB Assembly ? We provide SMT and PCB Assembly service in Indonesia. Located at bonded zone West Java Indonesia. Suitable for export oriented market.
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
New Equipment | Rework & Repair Services
BEST offers contract PCB rework services. If you get in bind and need resources to perform difficult repairs or if the volume of work ahead of you is too extreme to get through in the deadline at hand then consider BEST PCB rework services. If you th
Used SMT Equipment | SMT Equipment
Product name: YV100XGP YAMAHA chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/
Used SMT Equipment | SMT Equipment
Product name: YV100 yamaha economical chip mounter Product number: YV100 Products in detail YAMAHA multi-function chip mounter YAMAHA YV100A Substrate size: ATS20 (end to put) W - AT assembly: L460 * W250 (Max)/L50 * W50 (Min) Substrate thick
Industry News | 2003-06-18 08:04:27.0
Recently purchased and installed a new DP-1500-2X Dual-Sided Photoimageable Ink Coater from Circuit Automation
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon May 16 18:30:00 UTC 2022 - Wed May 18 18:30:00 UTC 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Work closely with production department in achieving production targets by continually supporting the production team. Setting up Process parameters for Critical process such as Solder Paste Printing, Reflow Soldering, Wave Soldering, BGA Rework
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Work closely with production department in achieving production targets by continually supporting the production team. Setting up Process parameters for Critical process such as Solder Paste Printing, Reflow Soldering, Wave Soldering, BGA Rework
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_ape_bga_rework_station.html
APE BGA Rework Station APE Rework Station Serial Numbers: 98SNPMEGA053 Model Number: 7007-2000 Year 1998 Sniper Split Vision System Includes Nozzles of Various Sizes 220 Volt - 50/60 HZ - 1800 watts CE Marked Last Calibrated 5/2016 Powered up in Good Condition! Location: Boston, MA Price: $ 3,000
| http://www.feedersupplier.com/BGA
BGA rework station part Loader parts -GOLDLAND SMT/AI Equipment & Parts wholesaler in China ---- Your best partner 简体中文 English 首页 产品展示 关于我们 联系我们 1 产品展示 Label Feeder SMT Feeders SIEMENS / AMS SIPLACE
