sikama 5c reflow over furnace - SMT Electronics Manufacturing

New SMT Equipment: sikama 5c reflow over furnace (1)

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Electronics Forum: sikama 5c reflow over furnace (1)

Voiding Control on AuSn preform reflow process

Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca

I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1

Express Newsletter: sikama 5c reflow over furnace (991)

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

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