Industry Directory: silicone potting (9)

Intek Adhesives Ltd

Industry Directory |

Supply of High temperature adhesives and thermally conductive RTV silicones, sealants, potting compounds, cyanoacrylates, solders and solder pastes, heat sink grease, epoxy resins

CHT USA

Industry Directory | Manufacturer

CHT USA manufactures an extensive range of silicone elastomer potting compounds, encapsulants, RTV silicone adhesives, foam, coatings and TIMs offering environmental protection and thermal management for electronic application.

New SMT Equipment: silicone potting (12)

Volumetric Pump - PCD

Volumetric Pump - PCD

New Equipment | Dispensing

Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog

GPD Global

resin of Epoxy, silicone compound, PU, UV curing resin.....

resin of Epoxy, silicone compound, PU, UV curing resin.....

New Equipment |  

website http://www.fongyong.com.tw Established in 1983, Fong Yong Chemical Co., Ltd. is professional manufacturer for Epoxy resins, PU resin, silicone compounds, UV curing resin series, Anaerobic locking agent resin series, Lubricant series and insta

Fong Yong Chemical Co., Ltd.

Electronics Forum: silicone potting (14)

Heat transfer properties of encapsulate potting material.

Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00

I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone

silicone conformal coat and electrical contacts

Electronics Forum | Tue Jan 30 14:12:12 EST 2007 | blnorman

We use nothing but silicones and have for at least the last 7 years. We don't have relays, but we do have motors. No issues with soldering, but our lines are constructed such that the last solder operation is a good distance from the coating or pot

Industry News: silicone potting (30)

2-Part Mixing is now Volumetric Dispensing!

Industry News | 2017-06-14 10:46:29.0

GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.

GPD Global

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

Parts & Supplies: silicone potting (4)

DEK BOOM  BOARD CLAMPS 500MM

DEK BOOM BOARD CLAMPS 500MM

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

Technical Library: silicone potting (1)

ADVANCED BORON NITRIDE EPOXY FORMULATIONS EXCEL IN THERMAL MANAGEMENT APPLICATIONS

Technical Library | 2020-10-14 14:33:36.0

Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.

Epoxy Technology, Inc.

Videos: silicone potting (14)

Fluid Dispensing: Total Control with PCD Pump

Fluid Dispensing: Total Control with PCD Pump

Videos

Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog

GPD Global

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Events Calendar: silicone potting (5)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Sensors West

Events Calendar | Wed Jun 27 00:00:00 EDT 2018 - Thu Jun 28 00:00:00 EDT 2018 | San Jose, California USA

Sensors West

Scheugenpflug Inc.

Express Newsletter: silicone potting (106)

SMTnet Express - August 12, 2021

SMTnet Express, August 12, 2021, Subscribers: 26,820, Companies: 11,423, Users: 26,800 Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board In this article

The Effect of Coating and Potting on the Reliability of QFN Devices.

The Effect of Coating and Potting on the Reliability of QFN Devices. Online Version SMTnet Express, August 28, 2014, Subscribers: 23150, Members: Companies: 14012, Users: 36727 The Effect of Coating and Potting on the Reliability of QFN Devices

Partner Websites: silicone potting (3951)

Dispense System - MAX

GPD Global | https://www.gpd-global.com/co_website/pdf/dispense/MAX-Dispense-System.pdf

. SMT Adhesive High speed glue dots. LED Encapsulation Silicone and phosphor mix. Potting Compounds Silicone or epoxy fills. * Contact GPD Global about additional applications

GPD Global


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