Printed Circuit Boards FR4 1.6mm 94V0 Solar Panel Rigid PCB Quik Details: Product Name: Solar Panel Rigid PCB Base Material: FR4 Epoxy Resin Bare Board Size: 120mm x155mm Surface Finishing: Leaded HASL PCB Material Flamming rate: 94
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef
Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i
Industry News | 2023-04-03 13:41:12.0
Heraeus Electronics is pleased to announce the development of a production friendly, flexible passive component termination ink. ET2010 Flexible End Termination Ink is a first of its kind material in the market utilizing advanced polymer technology. When compared to current thermoset, epoxy-based inks in the market, Heraeus' solution offers easier shipping, storage, and handling at room temperatures.
Industry News | 2012-10-16 21:44:41.0
Carlsbad, CA – October 16, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection, is proud to announce that their 850G DW metrology based AOI has won the award for Best New Product – USA at the award ceremony held at the SMTA International show in Orlando, Florida. The Global Technology Awards are hosted by Global SMT and Packaging Magazine.
Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications The silver end termination plays an important role
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
reference [7], an optimum gold thickness was determined. At the low end, the gaps in the plating resulted in voiding. At the high end, excess IMC growth occurred during reflow and reliability testing. The bondline thickness (BLT) of indium solder preforms is
