Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Electronics Forum | Fri Apr 13 21:02:19 EDT 2007 | Sam
Anyone experience using SnPb wire to gold plated ICs? I have tried to solder the SnPb wire to the gold plated ICs lead, but the surface finishing is dull. Can anyone explain that to me? Why it is not shinny surface? Any recommendation?
Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse
Plasma cleaning is used extensively to clean surfaces prior to wire bonding.
Used SMT Equipment | General Purpose Equipment
Need SIEMEN Silver Feeder 3*8 Size Part number : 00141098-S07 Qty : 8 pcs Please send details : 1) Front & Back of Feeders 2) Close up showing the serial plate 3) Price CIF Singapore (for China supplier please send to SHENZHEN location) 4)
Used SMT Equipment | Soldering Equipment/Fluxes
The following Ersa Ecoselect 350 is a lead free selective solder system with various spares. It is included in the Manroland Online Auction scheduled for August 27-28 on www.xlineassets.com. This system will be sold to the highest bidder and is curre
Industry News | 2003-06-13 09:56:46.0
Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S51
Parts & Supplies | Pick and Place/Feeders
USE ALTENATIVE PART > u FUJI S5120A SWITCH PHOTO FUJI S5124A SWITCH PHOTO FUJI S5125A SWITCH PHOTO FUJI S5126A SWITCH PHOTO FUJI S5128A SWITCH PHOTO FUJI S5129A SWITCH PHOTO FUJI S5133A SWITCH PHOTO FUJI S5134A SWITCH PHOTO FUJI S5135A SWITCH PHOTO F
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
03010415S01 Tension Spring Z-051GX 03010444S02 Hose, Placement Circuit 3*6*125 03010445S01 Hose, Query Placem.Circ.,6-Nozzle Head 03010482-01 LINE FILTER 03010496-01 CABLE FOR MOTOR MTC 2 03010513-01 CONTACTOR 3RT1015-1JB42 03010565-01 CALIBRAT
03006765-01 Kabel:Versorgung BE-Tisch ext. 03006767-03 Linear-motor Y-axis 03006775-02 Piping DLM2 HF-/X-Sseries 03006778-01 Piping TwinHead HF-/X-series 03006781S02 Portalsystem cpl.HF 03006796-01 BALLAST RESISTOR WITH PLATE 03006808-01 CABLE
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
SMTnet Express, July 18, 2019, Subscribers: 32,162, Companies: 10,836, Users: 24,951 Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution Credits: MacDermid Inc. The increased demand for electronic devices in recent years
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
SolderTips: Solderability Issues with Nickle Plated Surfaces | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://pcbasupplies.com/metal-wire/
) chrome plated wire shelf, (1) galvanized solid shelf, 1200 lb. capacity, (2) “U” shaped chrome plated handles, open base, donut bumpers, (4) 5
