25.0µm (>1 mil) Packing: Inner packing: vacuum packing/plastic bag Outer packing: standard carton packing Shape tolerance: ±0.13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05 With UL, SGS and RoHS marks Special requirements: buried and blind via +
PGB-200 Dispensing machine equipment for epoxy resin filling machine AB component glue potting machine epoxy application Product Description Machine specification: 2 Part Epoxy Resin Encapsulated Transformer Potting Filling Mixing Dispenser AB Gl
Electronics Forum | Tue Feb 26 21:23:21 EST 2008 | davef
Several methods are available for singulating or extricating individual flexible circuits from a processed panel; this discussion of the topic applies to all types of flexible circuits. In general, the methods for singulating flex circuits can be bra
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
Industry News | 2020-07-01 12:08:16.0
For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.
Industry News | 2022-02-17 12:52:30.0
Cleanly and easily separate a row of up to 10 tabs without dust. Singulating tab routed printed circuit cards in low to medium volume production quantities is safe and easy with the N115 Nibbler from FKN Systek. Two sharp support blades on either side of the tab help cleanly slice the PCBs from the tabs.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
The LPKF MicroLine 1000 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter time to market and much higher quality cuts than conventional methods. The machine's UV laser is an optimal tool fo
SMTnet Express, April 27, 2017, Subscribers: 30,419, Companies: 10,583, Users: 23,183 Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling Ahne Oosterhof, Eastwood Consulting. Using modern laser
SMTnet Express, September 12, 2019, Subscribers: 32,222, Companies: 10,879, Users: 25,108 Investigation of Cutting Quality and Mitigation Methods for Laser Depaneling of Printed Circuit Boards Credits: LPKF Laser & Electronics There are numerous
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) Design for Manufacturability (DFM) Design for Test (DFT) Embedded Passive and Active Devices CAD Design Tools Printed Electronics Flexible Circuits RFID Circuitry
Imagineering, Inc. | https://www.pcbnet.com/blog/7-pcb-design-software-programs-for-electrical-engineers-designers/
electronic circuits. Is DipTrace the Right Fit for My Company? G2 scores DipTrace as 4.3 out of 5. Users who want to use DipTrace should consider their use cases, what they can afford, and what level of support they will need to run the program effectively
Hitechpcba is a wоrld-lеаding PCB Manufacturing & PCB Assembly company with more than 20 years experience in the electronics manufacturing industry. We focus on Circuit board fabrication, PCB assembly, electronic parts sourcing.
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