Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service
Industry Directory | Manufacturer
Innovative and precision SMT contract manufacturing. Our main activity is manufacturing of PCB boards with SMT technology and activities linked with this technology
http://www.flason-smt.com/product/SIPLACE-SIEMENS-ASM-NOZZLE-MAGAZINE-7-9XX.html SIPLACE SIEMENS ASM NOZZLE MAGAZINE 7 9XX NOZZLE MAGAZINE Siemens NOZZLE MAGAZINE SIPLACE SIEMENS ASM NOZZLE MAGAZINE 7 9XX Usage:Siemens pick and place machine
http://www.flason-smt.com/product/Siemens-Siplace-ASM-0201-01005-03015-NOZZLE.html Siemens Siplace ASM 0201 01005 03015 NOZZLE SMT Nozzle Siemens Nozzle Siemens Siplace ASM 0201 01005 03015 NOZZLE Usage:Siemens pick and place machine Product
Used SMT Equipment | Pick and Place/Feeders
This lot contains three items: (1) 80 F5 Dimensions: 78" x 64" x 72" (1) WPW 80F/F4 930mm Dimensions: 60" x 36" x 60" (1) Line Controller Setup Serial: 662-12000151
Used SMT Equipment | Pick and Place/Feeders
This lot contains three items: (1) 80 F5 HM Dimensions: 78" x 64" x 72" (1) WPW/3-950 Dimensions: 60" x 36" x 60" (1) Line Controller Setup Dimensions: 48" x 32" x 58"
Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
Events Calendar | Wed Apr 07 18:30:00 UTC 2021 - Wed Apr 07 18:30:00 UTC 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | Tampa, Florida USA | Engineering,Management,Research and Development,Sales/Marketing,Technical Support
Spartronics is more than just a company. We have great facilities, a dedicated and talented team, tremendous capacity and capabilities, and longstanding customers who need us. Now, it’s all about driving forward with a winning strategy that bui
Career Center | Bangalore, Paktika India | Production,Quality Control
Line audits 5’s line audits RoHS line audits Screen printing machine operating S.M.T M/c Operator “Siemens” HS-60, S-27, F5HM. S.M.T Fuji, cp6, ip3, xp143 & 243 M/c Technician. Awareness of reflow profiling and verification Servicing of mobile sets a
Career Center | Guadalajara, Jalisco Mexico | Engineering,Management,Sales/Marketing
Summary of achievements Company in GDL, Siemens recognized as a partner I had been acting as the interface between the customer and Siemens EAS. This site had 107 SIPLACE machines in three different buildings in the same campus, and I was coor
| https://www.feedersupplier.com/sale-13949755-asm-siemens-siplace-60-feeder-carts-00519922-smd-feeder-trolley.html
ASM Siemens Siplace 60 Feeder Carts 00519922 SMD Feeder Trolley Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
Lewis & Clark | https://www.lewis-clark.com/product/2007-siemens-siplace-f5-pick-and-place/
Siemens Siplace F5 Pick and Place-2007 - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart
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