Industry Directory | Manufacturer
We are looking for Siemens machine as HS60 /HS50 /F4 / F5 and ...........
Industry Directory | Equipment Dealer / Broker / Auctions
Our company has all kinds of SMT parts(e.g Juki Feeders,Siemens Feeders, Philips Feeders, Yamaha Feeders etc.) and equipents(e.g Siemens HS50/HS60, CM402/CM602 ect.) for sale with low price.
Description Make/Brand - ASM / Siemens Model - Siplace SX-1 Year - 2021 VIN/Serial - P2656G-12046944 Lot# - 13360-27 Condition - Used/See Description Inventory ID - E629113 ASM / Siemens Siplace 'SX-1' Placement Machine, S/N P2656G-12046944
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
Electronics Forum | Thu Dec 11 23:38:44 EST 2003 | liang
Thank you Stefan for your help! our machine is hs50.you are right we means components are not placed on board.we can found the part around the loctation.i found bearing is dirty.i clean it with threebond.it can work well. but i want to know the rootc
Used SMT Equipment | Pick and Place/Feeders
1999 Siemens SIPLACE 80 S15 SMT Pick & Place Power: 230/400 VAC; 50/60 Hz Machine Dimensions: 64" x 100" x 68" (excluding light tower) Note: Two Feeder Tables are included in this lot. S/W Version: 010.01 Nozzle Change Option Serial: 790-120
Used SMT Equipment | Pick and Place/Feeders
This lot contains three items: (1) 80 F5 HM Dimensions: 78" x 64" x 72" (1) WPW/3-950 Dimensions: 60" x 36" x 60" (1) Line Controller Setup Dimensions: 48" x 32" x 58"
Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00363775-01 BERO ADJUSTING UNIT 1 00363776-01 BERO ADJUSTING UNIT 2 00363777-01 SWITCH WIDTH ADJUSTMENT 1 00363778-01 SWITCH WIDTH ADJUSTMENT 2 00363779-02 VALVE WITH CABLE ADJUST.
Parts & Supplies | SMT Equipment
03038426-01 Protection foil X-Trail 03038427-01 spool valve 5/2 subbase mounted DN6 24V 03038429-01 spool valve 3/2 NW4 24V 1,5-8bar 03038456S01 SPLICE SENSOR S3 03038587-01 SHORT STROKE ZYLINDER 50x40 ECDQ2850-0040-CEJ00119 03038594-01 PRESSURE
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
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Spartronics is more than just a company. We have great facilities, a dedicated and talented team, tremendous capacity and capabilities, and longstanding customers who need us. Now, it’s all about driving forward with a winning strategy that bui
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I had 15 years Handling SMT Equipment.
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Specialized in Siemens equipment, and OmniExcel 7, MPM Ap25, Momentum.
composition Sn40-Bi60 has been manufactured by quenching me
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