Fine Line Stencil’s new UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all other existing stencil technologies on the market
Industry News | 2013-01-17 09:22:05.0
FCT Assembly announces that it will highlight its new NanoSlic™ Multilayer Coating for the first time in booth #2627 at the upcoming IPC APEX EXPO
