Industry Directory | Manufacturer
Offers bare sensors for system integration, offline benchtop tools and online scanners for metrology and inspection applications.
PROwave working in conjunction with the PROfiler datalogger monitors and reports all the critical parameters of your wave soldering process. Simply send PROwave through your wave soldering machine and accurate measurements of key process parameters a
New Equipment | Test Equipment
This product is NEW. The DS6064 Digital Oscilloscope has 600 MHz Bandwidth and optional 1.5GHz bandwidth differential and single-ended active probes (model RP7150). These new products are designed and produced by RIGOL with many key technological b
Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
Electronics Forum | Fri Jul 09 07:14:36 EDT 2010 | cobar
http://www.shanelo.co.za/reflow_profile_adjustment.htm http://www.shanelo.co.za/how_to_profile_a_pcb.htm http://www.shanelo.co.za/SMD%20Assist.htm
Used SMT Equipment | Soldering - Reflow
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel
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Used SMT Equipment | AOI / Automated Optical Inspection
3D Hybrid optical inspection system (AOI) YSi-V Includes 2 dimensional inspections, 3 dimensional inspections and 4-way oblique imaging inspections all in one unit! TypeHS2 realizes highest level inspection speed by further accelerating TypeH
Industry News | 2019-12-11 06:21:54.0
Superpower lasers are characterized by small size, light weight, high electro-optic conversion efficiency, stable performance, high reliability and long life. At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating.
Industry News | 2019-12-16 22:23:49.0
In recent years, the automotive industry headlights using LED, especially the of large power LED chip more and more. Especially in the headlamp part of the large hernia lamp with high-power high-power LED panel, the effect is very good.
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Parts & Supplies | Pick and Place/Feeders
How to maintenance NXT work head If you have ever used XP machine,you should know as FUJI Fuji Mounter masterpiece, XP series of machines exist for 10 years, is a very mature product, involving the XP series machines, XP141E, XP142E, XP143E XP241E,
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Parts & Supplies | Assembly Accessories
KLJ-MC181-01 handle for ZS 8mm feeder Other Yamaha feeder parts on sale: NO Parts_No. Parts_Name Q'ty Remarks Change Compati 1 90990-01J042 BOLT,HEX.S/H 1 2 KHJ-MC104-00 RAIL,UNDER 1 3 KHJ-MC10F-00 SCREW,FLAT HEAD 2 4 KLJ-MCN0C-S0 SEAL,MAIN LAB
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
At present, the low-power laser and the medium-power laser are gradually being localized, while the superpower lasers are just beginning to be localized and is accelerating. How to improve the reliability of superpower lasers welding is an urgent tec
Heller Industries Inc. | https://hellerindustries.com/1810-mark-v-series-smt-reflow-oven/
– Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature
| http://etasmt.com/cc?ID=te_news_industry,24161&url=_print
. It reduces the thermal loss as well as gets better flux reclamation. The Cooling fans’ speed can be controlled so they meet cooling slope requirement on thermally-challenging board assemblies. Keywords
