Industry Directory | Distributor / Manufacturer
Equip-Test with Global Headquarter in Budapest Metropolitan Area, Europe is a global player in manufacturing PCB test equipment.
JUKI JM-100 Hybrid Placement Machine Board size 410×360mmComponent Size: 0603～50mmPlacement Speed:16,000CPHPCB Weight max.4kgProduct description: JUKI JM-100 Multi Task Platform Hybrid Placement Machine, Board size 410×360mm, Component Size: 0603～50
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
Electronics Forum | Wed Jun 11 16:41:57 EDT 2014 | isd_jwendell
With Essemtec software you can specify to turn on vacuum once the nozzle is down at the part. The default method is to turn on the vacuum while the nozzle is up, but starting to move down. For light/tiny parts this can have the effect of making them
Electronics Forum | Wed Jun 11 11:33:26 EDT 2014 | fredcalkins
I do not have machine experience, but I think vacuum too early would be a more likely cause of chips leaping to a nozzle. Juki nozzles are made of hardened stainless and could be slightly magnetic, but the end is relatively small and would not have t
Used SMT Equipment | Pick and Place/Feeders
Samsung SM320 Pick and Place Machine Specifications: Chip theoretical speed ：18500CPH Mounting range 0402mm Chip ~ □ 55mm IC Placement accuracy plus or minus 0.03mm PCB size 510 * 460-460 * 400mm Equipment size 50 x 40 mm ~ 460 x 400mm Co
Used SMT Equipment | Screen Printers
Details: • 2D Vision • 29” x 29” stencil frame size • Max PCB size 20” x 16” • Programmable Under head • Stencil Wipe with Vacuum • HiE 4th Axis movement • Front and back Y-Snuggers for PCB hold down • Auto conveyor rail adjust • Windows Ope
Industry News | 2009-06-10 10:17:32.0
The best place to buy SMT Nozzles just got even better. New interactive online catalog!
Industry News | 2010-08-17 11:50:19.0
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its newly redesigned series of Siemens ceramic replacement nozzles.
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Parts & Supplies | SMT Equipment
Yamaha head up down sensor (KGB-M653A-01X) KH4-M9166-00X YAMAHA Air cylinder KHY-M7153-00X YAMAHA Solenoid valve JA10AA-21W KM1-M7162-10X YAMAHA YV100X/XG/II Solenoid valve A040E1-56W KM1-M7162-11X YAMAHA YV100TT Solenoid valve A040E1-54W KM1-M
Parts & Supplies | SMT Equipment
KGS-M7171-A0X EJECTOR VACUUM EJECTOR AME05-E2-PSL-32W YG100R KM1-M7163-20X VALVE A010E1-37W KM1-M7163-30X VALVE A010E1-44 KGS-M7111-02X PLATE, HEAD 1 KGS-M7112-02X HOUSING, SHAFT 1 KGS-M7113-02X DAMPER, Z DOWN 1 KGS-M7115-02X SLEEVE, SPRIN
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
PCB vacuum suction loader/SMT vacuum loader for loading bare board on PCB assembly line: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/123.html ASCEN PCB vacuum loader we produced is mainly used for the beginning of the SMT produc
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
Career Center | north augusta, South Carolina USA | Production,Quality Control
I am a skilled smt operator that pays close attention to detail! With my experience in the electronic field for the passed 10 years proving to be an asset to all companies that i have worked for in providing quality work and ensuring on time delivery
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KingFei SMT Tech | https://www.smtspare-parts.com/buy-smc_vacuum_valve-page4.html
Buy smc vacuum valve, Good quality smc vacuum valve manufacturer Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
