Industry Directory | Manufacturer
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
Two-piece Drawn RF Shields Engineering Kit, EMI Shielded Cans, RF Shielding Cabinets for PCB, Board Level Shielding, Tin Plated Steel, SMD. Seamless Protective EMI/RFI Cages, available for purchasing online! Complimentary CAD files are available for
New Equipment | Coating Materials
Omni-directional conductive sponge are ventilate and flexible,use for making shielding gasket,I/O gasket.Soft conductive foam EMI gaskets are ideal for applications that require conformability,excellent EMI shielding,and superior conductivity at low
Electronics Forum | Thu Jul 09 08:03:48 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Electronics Forum | Thu Jul 09 08:04:11 EDT 1998 | smd
OK, I'll take a little abuse as long as you guys are giving me all this great advice. I am concerned about what might happen when a drop here and there comes from the connectors and is absorbed into the box. The box is going to suffer from this. I am
Used SMT Equipment | General Purpose Equipment
Omni-directional conductive sponge are ventilate and flexible,use for making shielding gasket,I/O gasket.Soft conductive foam EMI gaskets are ideal for applications that require conformability,excellent EMI shielding,and superior conductivity at
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Parts & Supplies | Pick and Place/Feeders
We also supply following Siemens Spare parts : 00323726S01 BE-VISION SIPLACE 80F 00323837-03 SMD Dummy 0603 00323853-01 RECTIFIER Br. 4,5A/800V 00323854-01 RECTIFIER BRW4TT40004-14 200V 36A 00323887-01 Expulsion fuse 5SX5 / 1pole / 25
Parts & Supplies | X-Ray Inspection
Omni-directional conductive sponge are ventilate and flexible,use for making shielding gasket,I/O gasket.Soft conductive foam EMI gaskets are ideal for applications that require conformability,excellent EMI shielding,and superior conductivity at low
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
SMTnet Express, February 27, 2020, Subscribers: 34,359, Companies: 10,970, Users: 25,651 Dispensing EMI Shielding Materials: An Alternative to Sputtering Credits: Nordson ASYMTEK Shielding electronic systems against electromagnetic interference
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
. This can lead to unwanted reflection between components. Use EMI Shielding In some cases, a certain amount of EMI is unavoidable. Luckily, it’s still possible to produce a high-quality circuit board by utilizing EMI shielding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/electronics-assembly-and-packaging?con=t&page=39
. • Nordson hot melt and related adhesive systems : Solutions for plastic bonding, electronics assembly, gasketing, hot melt molding, encapsulating and shielding applications
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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