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Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Underfill, FPC, Glob Top, Dam & Fill, Surface Mount Adhesive, LED Packaging, BGA Edge Bonding, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated. Viscosity Contr
Increased Dispense Area over SD6 Series for Underfill, Glob Top, Dam & Fill, LED Packaging, Surface Mount Adhesive Dispensing, etc. Features and Benefits Convenience – With non-contact injection technology, the need to move the z-axis up and down
Electronics Forum | Mon May 07 17:59:07 EDT 2001 | davef
One thing I forgot to add about the globs of solder on your bottom side SMT components after wave soldering: The excess solder is likely reducing the reliability of these components, because of the difference in CTE betweeen the ceramic base on the
Electronics Forum | Sat Jul 16 07:46:17 EDT 2005 | davef
If you have a glob of epoxy on your board, it will be difficult to stencil you paste on that side. Dispensing paste may be a better choice.
Industry News | 2015-04-13 16:23:08.0
Specialty Coating Systems (SCS) today announced that it will be represented in two booths, 7A-321 and 7-159, at the upcoming SMT/Hybrid/Packaging show, scheduled to take place May 5-7 at the Messe in Nuremberg, Germany. SCS will debut its new Precisioncoat V conformal coating system in both booths.
Career Center | San Isidro Cabuyao Laguna, Philippines | Engineering,Maintenance,Production,Technical Support
Duties & Responsibilities (Equipment Technician): Production line support, conduct setup and troubleshooting on handled machines such as COB and backend equipment. Conduct Preventive maintenance
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: An Engineer's Handbook of Encapsulation and Underfill Technology Author
SMT Express, Volume 2, Issue No. 2 - from SMTnet.com Volume 2, Issue No. 2 Thursday, February 17, 2000 Special Announcements New Talkback Feature Added to Newsletter Articles Featured Articles Packaging Reliability Assessment of a Thin
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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3 Road Xintang， Fuhai Street，Fuyong
Shenzhen, 30 China
Phone: 13713862102
