Industry Directory | Consultant / Service Provider / Manufacturer
PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.
Industry Directory | Consultant / Service Provider
We work on the physical design, reliability and failure analysis of electronic components, solder joints and PCB assemblies. We provide expertise in the assessment of both standard SnPb and Pb-free solder joint reliability.
New Equipment | Education/Training
This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure
New Equipment | Solder Materials
We manufacture both solder preforms and pad repair kits. Our geometries are available starting at 25um and up in SnAg, SnPb, Cu and Au, Ag and other finishes.
Electronics Forum | Sat Aug 02 06:40:51 EDT 2014 | madhuranatha
Will there be any issue if soder paste of SnPbAg is used for airborne application (PCB)
Electronics Forum | Fri Oct 01 02:46:47 EDT 2021 | sn
Thanks, Evtimov. In terms of mechanical drop performance, can we conclude that the higher Ag alloy will have poorer drop shock performance relatively compare to those with lower Ag? The Ag3Sn is a good IMC for welding strength?
Used SMT Equipment | Soldering - Wave
Speedline Electrovert Wave Soldering Machine Model: Vectra 450F Year: 2001 Power: 480V / 3-Phase 3 Bottom-Side Preheat (2 Convection + 1 IR) 1 Top-Side Preheat (IR) Leaded Pot (63/37 SnPb)
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2003-06-20 08:18:46.0
Providing the ideal solution to high-current PCB applications where height restrictions are a major consideration is Finder's 40.11 series flatpack PCB relay.
Parts & Supplies | Pick and Place/Feeders
Juki CF8L1 SMT feeder Juki relevant spare part in stock E6300706000 Juki 32mm Feeder Return Spring E6301706000 Juki 32mm Feeder Reel Spring E6322705000 Juki Feeder Screw E6350705000 JUKI feeder spring E6367705000 Juki Feeder Parts
Parts & Supplies | Chipshooters / Chip Mounters
Detailed Product Description WE provide SMT kinds of feeders , feeder carts , ball spline , machines, nozzles, motors, valve , belt…etc., Main business are CM402,CM602,CM101,NPM,BM, YAMAHA....etc., Original new and used both have , if you are inte
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2011-08-25 17:47:23.0
While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about the high reflow temperatures of SAC or relies on ODM, it is im
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf
| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
