Industry Directory | Manufacturer
The UK's largest producer of ultra pure solder alloys for the electronics assembly and HASL industry across Europe.
Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost imp
New Equipment | Solder Materials
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared t
Electronics Forum | Tue Jun 27 08:38:03 EDT 2006 | cuculi54986@yahoo.com
I tried some SN100C from AIM... On only one array. It flowed well on the chips but did not like the finish on the SOT23's on the board. I did not have enough arrays to mess around, so we switched it over to SAC305 and had no issues. I'm guessing w
Electronics Forum | Mon Mar 17 04:31:52 EDT 2008 | d0min0
Hello, tried searching the SMTnet archives, but not yet a clear answer - maybe there is not a one yet ? ;) last discussion I found is few years old so maybe there is a fresh view on that? Q: we want to prove that our proces is "clean" we use SAC30
Industry News | 2010-09-01 21:50:50.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that SN100C wets and spreads faster than SAC305.
Industry News | 2010-09-14 17:20:46.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has released a video demonstrating the results of an evaluation comparing the wettability and spreadability of SN100C and SAC305 solder alloys on stranded wire.
Technical Library | 2008-03-31 21:35:36.0
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
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ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
be briefly discussed, including process control, contamination, cost and supply chain considerations. There is enough data to indicate that several alternative Pb-free alloys available on the market today are suitable replacements to SAC305/405 for PTH
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/custom-interconnect-limited-installs-latest-nordson-select-novo-460pd-selective-soldering-system
460PD by filling one pot with SAC305 alloy and the other with tin-lead alloy. As each board type is programmed into the machine, we can configure it to use the relevant solder pot with zero chance of cross contamination
