New Equipment | Solder Materials
New Precision BGA Spheres Optimize Sphere Performance Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA¬ and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accura
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
Electronics Forum | Thu Dec 02 07:40:54 EST 2010 | scottp
2000 cycles of -40/+150C thermal cycling.
Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip
1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Technical Library | 2023-01-02 17:50:34.0
Silver bearing alloys have been used in electronics soldering for many years. Silver has been used in tin-lead solders (Sn62Pb36Ag2) to combat silver scavenging from silver plated electronic components as well as to improve thermal fatigue resistance. Many of the common lead-free alloys contain some amount of silver. Silver bearing alloys have good electrical and thermal conductivity as well as the ability to wet to the common surface finishes used in printed wiring assemblies, thus giving it all the attributes needed for an electronic solder alloy. Presence of silver in Sn based solders increases the bulk solder modulus and is generally believed to improve resistance to fatigue from thermal cycles. Increased solder modulus can be advantageous or disadvantageous depending on the desired performance attribute. For example in high strain rate situations, higher modulus of the bulk solders results in lower life time. A wide variety of leaded and lead-free
SMTnet Express, March 7, 2019, Subscribers: 31,716, Companies: 10,725, Users: 25,814 Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints Credits: DfR Solutions Electronic assemblies use a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/safety-data-sheets
Sn62 Sn62 Pb36 Ag2 Sn63 Sn63 Pb37 Sn10 Sn10 Pb88 Ag2 Pb90 Sn10 Pb90 Pb92.5 Sn5 Pb92.5 Ag2.5 Sn5 Sn5 Pb95 Schritt 3 Wählen Sie unten Ihr Land/Ihre Region aus, um ein SDS mit der gleichen Kombination oder dem gleichen Flussmitteltyp und verbleit vs. bleifrei zu finden
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. For 63Sn/37Pb solder paste with a melting point of 183℃ and Sn62/Pb36/Ag2 solder paste with a melting point of 179℃, the peak temperature is generally 210-230
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