New SMT Equipment: sn63pb37 balls melting poin (1)

AMTECH BGA Solder Spheres

AMTECH BGA Solder Spheres

New Equipment | Solder Materials

AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N

AMTECH

Electronics Forum: sn63pb37 balls melting poin (4)

BGA ball and PCB pad

Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack

Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 10 20:58:05 EST 2005 | Mike

How about this scenario: Need to rework a BGA on a 2 year old board. Originally the board was assembled with Sn63/Pb37 and the BGA has eutectic spheres. Now this package only comes with lead free balls. I believe that the board finish is not idea

Industry News: sn63pb37 balls melting poin (2)

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

Express Newsletter: sn63pb37 balls melting poin (182)


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