Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
AMTECH’s BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. AMTECH BGA solder spheres also exceed both the IPC and MIL standards for purity levels and size tolerances. N
Electronics Forum | Fri Mar 20 05:07:16 EDT 2009 | rocko
Hi All, I was puzzled because of terrible blowholes in solder joints of gold plated odd-form components. I am very confused because all other components on the boards have perfect solder joints. Here are some process details: 1) Solder paste: N
Electronics Forum | Thu Oct 14 17:10:37 EDT 2010 | hegemon
Heck, now I look up and see this is SMTdotNET. Do I get banned for asking a TH question? So here's my first real TH issue after living so long in the SMT world. We are having a sudden issue in what has been a stable process for quite some time. I
Used SMT Equipment | Soldering - Wave
Speedline VectraElite Automated Wave Soldering Machine (2007) Brand: Speedline Model: VectraElite Year: 2007 Serial #: VC2-15869 Type: Automated Wave Soldering Machine Machine Specifications: Voltage: 480V Solder used: SN63Pb37 Sono
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2010-09-29 01:30:07.0
FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Technical Library | 2007-11-15 15:54:44.0
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
% Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1
