New Equipment | Solder Materials
For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S
Electronics Forum | Mon Apr 01 10:24:29 EDT 2013 | emeto
First check the profile. I would go with linear profile and smoother increase of temperature. Usually you will get tombstones when you have too aggressive profile. My next step will be to redesign the stencil.
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
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