New Equipment | Solder Materials
FCT Assembly has partnered with Nihon Superior to be able to offer their patented lead free nickel stabilized tin/copper wave solder alloy- SN100C in North America. SN100C was developed to offer a technically superior and more economical option to th
New Equipment | Solder Materials
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Tue Apr 28 09:06:19 EDT 2009 | nibirta
Well the only spec is 10.88% flux, 89.12% metal. the problem is only at one specific capacitor we have this issue. Sn over Ni finish. Sn-Ag solder paste. I have read all the arhives from the site, but nothing explains me what is happening.everything
Industry News | 2019-08-21 17:00:15.0
Nihon Superiorwill exhibit in Booth #518 at 2019 SMTA International. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Industry News | 2009-05-11 11:46:12.0
OSAKA, JAPAN � May 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the global market, announces that Nihon Superior was awarded a plaque in honor of the company's 10th anniversary of its SN100C lead-free solder alloy. The award was presented by Reed China during the recent NEPCON China exhibition and conference that took place in Shanghai, China.
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
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Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
-Pb alloy. There are a handful of alternative Pb-free alloys available on the market today, which are variations of Sn-Ag-Cu or Sn-Cu based alloys which have varying degrees of elemental additives such as nickel (Ni), germanium (Ge), bismuth (Bi
Blackfox Training Institute, LLC | https://www.blackfox.com/news-events/should-you-use-lead-or-lead-free-solder/
. When you look at a spool of leaded solder, the numbers next to Sn and Pb, like Sn63/Pb37, indicate how much tin and lead is in that solder
